HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 932

• Manufacturer Part Number: HD6417712BPV
• Description: MPU 1.5/3.3V 0K PB-FREE 256-BGA
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH Ethernetr

Specifications of HD6417712BPV

• Core Processor: SH-3 DSP
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO
• Peripherals: DMA, POR, WDT
• Number Of I /o: 24
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 256-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Section 24 Electrical Characteristics
Rev. 1.00 Dec. 27, 2005 Page 888 of 932
REJ09B0269-0100
A12/A11 *
D31 to D0
A25 to A0
DACKn *
RD/WR
DQMxx
CKIO
RAS
CAS
CKE
Figure 24.35 Synchronous DRAM Burst Write Bus Cycle (Single Write × 4)
CSn
BS
1
2
Different Row Address, TRCD = 1 Cycle, TRWL = 1 Cycle)
(Bank Active Mode, PRE + ACTV + WRITE Commands,
t
t
t
t
t
t
Notes: 1. Address pin to be connected to A10 of SDRAM.
t
AD1
AD1
CSD1
RWD1
RASD1
DACD
DQMD1
Tp
2. DACKn is a waveform when active-low is specified.
t
t
t
RASD1
AD1
RWD1
Row address
Tpw
t
RASD1
Tr
t
t
t
t
t
t
t
RASD1
AD1
AD1
RWD1
CASD1
BSD
WDD2
Tc1
(High)
t
t
AD1
WDH2
Tc2
Column
address
Write command
t
AD1
Tc3
(1-4)
t
t
AD1
WDD2
Tc4
t
t
t
t
t
t
t
t
t
t
RWD1
AD1
AD1
RASD1
CASD1
WDH2
DACD
CSD1
BSD
DQMD1