HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 489
![MPU 1.5/3.3V 0K PB-FREE 256-BGA](/photos/28/61/286175/256-lfbga_sml.jpg)
HD6417712BPV
Manufacturer Part Number
HD6417712BPV
Description
MPU 1.5/3.3V 0K PB-FREE 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH Ethernetr
Datasheet
1.HD6417712BPV.pdf
(980 pages)
Specifications of HD6417712BPV
Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals
DMA, POR, WDT
Number Of I /o
24
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD6417712BPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 489 of 980
- Download datasheet (6Mb)
Figure 12.35 Wait Timing for Byte-Selection SRAM (BAS = 1) (Software Wait Only)
Write
Read
WEn(BEn)
A25 to A0
D31 to D0
D31 to D0
DACKn*
RD/WR
RD/WR
CKIO
CSn
RD
RD
BS
Note: The waveform for DACKn is when active low is specified.
Th
T1
Tw
High
Rev. 1.00 Dec. 27, 2005 Page 445 of 932
Section 12 Bus State Controller (BSC)
T2
Th
REJ09B0269-0100
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