HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 472

MPU 1.5/3.3V 0K PB-FREE 256-BGA

HD6417712BPV

Manufacturer Part Number
HD6417712BPV
Description
MPU 1.5/3.3V 0K PB-FREE 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH Ethernetr
Datasheet

Specifications of HD6417712BPV

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals
DMA, POR, WDT
Number Of I /o
24
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417712BPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 12 Bus State Controller (BSC)
Refreshing: This LSI has a function for controlling synchronous DRAM refreshing. Auto-
refreshing can be performed by clearing the RMODE bit to 0 and setting the RFSH bit to 1 in
SDCR. A continuous refreshing can be performed by setting the RRC[2:0] bits in RTCSR. If
synchronous DRAM is not accessed for a long period, self-refresh mode, in which the power
consumption for data retention is low, can be activated by setting both the RMODE bit and the
RFSH bit to 1.
Rev. 1.00 Dec. 27, 2005 Page 428 of 932
REJ09B0269-0100
Figure 12.24 Single Write Timing (Bank Active, Different Row Addresses)
A12/A11*
A25 to A0
D31 to D0
DACKn*
RD/WR
DQMxx
Notes: 1. Address pin to be connected to the A10 pin of SDRAM.
CKIO
RAS
CAS
CSn
BS
1
2
2. The waveform for DACKn is when active low is specified.
Tp
Tpw
Tr
Tc1

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