HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 447
![MPU 1.5/3.3V 0K PB-FREE 256-BGA](/photos/28/61/286175/256-lfbga_sml.jpg)
HD6417712BPV
Manufacturer Part Number
HD6417712BPV
Description
MPU 1.5/3.3V 0K PB-FREE 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH Ethernetr
Datasheet
1.HD6417712BPV.pdf
(980 pages)
Specifications of HD6417712BPV
Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals
DMA, POR, WDT
Number Of I /o
24
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD6417712BPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 447 of 980
- Download datasheet (6Mb)
Notes: 1. L/H is a bit used in the command specification; it is fixed at low or high according to the
A2/3
BSZ
[1:0]
11 (32 bits)
Output Pin of
This LSI
A1
A0
2. Bank address specification
3. If the number of 16-Mbit SDRAM (512 kwords × 16 bits × 2 banks: pin with 8-bit
access mode.
column) is two, the bank address specification is not required. Therefore, the bank
address should be not used.
64-Mbit product (512 kwords x 32 bits x 4 banks, column 8 bits product): 1
16-Mbit product (512 kwords x 16 bits x 2 banks, column 8 bits product): 2
A2/3
ROW
[1:0]
00 (11 bits)
Row Address
Output
A9
A8
Setting
A2/3
COL
[1:0]
00 (8 bits)
Column Address
Output
A1
A0
Example of connected memory
Synchronous DRAM
Pin
Rev. 1.00 Dec. 27, 2005 Page 403 of 932
Section 12 Bus State Controller (BSC)
Function
Unused
REJ09B0269-0100
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