HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 922

• Manufacturer Part Number: HD6417712BPV
• Description: MPU 1.5/3.3V 0K PB-FREE 256-BGA
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH Ethernetr

Specifications of HD6417712BPV

• Core Processor: SH-3 DSP
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO
• Peripherals: DMA, POR, WDT
• Number Of I /o: 24
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 256-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Section 24 Electrical Characteristics
Rev. 1.00 Dec. 27, 2005 Page 878 of 932
REJ09B0269-0100
A12/A11 *
D31 to D0
A25 to A0
DACKn *
RD/WR
DQMxx
Figure 24.25 Synchronous DRAM Burst Read Bus Cycle (Single Read × 4),
CKIO
RAS
CAS
CKE
CSn
BS
(Auto Precharge, CAS Latency = 2, TRCD = 2 Cycle, TRP = 1 Cycle)
1
2
Notes: 1. Address pin to be connected to A10 of SDRAM.
t
t
t
t
t
t
t
RASD1
AD1
RWD1
DQMD1
DACD
AD1
CSD1
Tr
Row address
2. DACKn is a waveform when active-low is specified.
t
RASD1
Trw
t
t
t
t
BSD
AD1
AD1
CASD1
Tc1
Read command
(High)
t
AD1
Tc2
address
Column
t
AD1
Td1
Tc3
t
RDS2
t
t
t
AD1
AD1
RDH2
Td2
Tc4
command
(1 to 4)
Read A
t
t
t
AD1
CASD1
BSD
Td3
Td4
t
RDS2
t
t
t
t
DQMD1
CSD1
RDH2
DACD
Tde
t
t
AD1
RWD1