HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 474

• Manufacturer Part Number: HD6417712BPV
• Description: MPU 1.5/3.3V 0K PB-FREE 256-BGA
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH Ethernetr

Specifications of HD6417712BPV

• Core Processor: SH-3 DSP
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO
• Peripherals: DMA, POR, WDT
• Number Of I /o: 24
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 256-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Section 12 Bus State Controller (BSC)
2. Self-refreshing
Rev. 1.00 Dec. 27, 2005 Page 430 of 932
REJ09B0269-0100
Self-refresh mode in which the refresh timing and refresh addresses are generated within the
synchronous DRAM. Self-refreshing is activated by setting both the RMODE bit and the
RFSH bit in SDCR to 1. After starting the self-refreshing, PALL command is issued in Tp
cycle after the completion of the pre-charging bank. A SELF command is then issued after
inserting idle cycles of which number is specified by the TRP[1:0] bits in CSnWSR.
Synchronous DRAM cannot be accessed while in the self-refresh state. Self-refresh mode is
cleared by clearing the RMODE bit to 0. After self-refresh mode has been cleared, command
issuance is disabled for the number of cycles specified by the TRC[1:0] bits in CSnWCR.
A12/A11*
A25 to A0
D31 to D0
DACKn*
RD/WR
DQMxx
CKIO
RAS
CAS
CSn
BS
1
2
Notes: 1. Address pin to be connected to the A10 pin of SDRAM.
Figure 12.25 Auto-Refresh Timing
Tp
2. The waveform for DACKn is when active low is specified.
Tpw
Trr
Hi-z
Trc
Trc
Trc