HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 28

• Manufacturer Part Number: HD6417712BPV
• Description: MPU 1.5/3.3V 0K PB-FREE 256-BGA
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH Ethernetr

Specifications of HD6417712BPV

• Core Processor: SH-3 DSP
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO
• Peripherals: DMA, POR, WDT
• Number Of I /o: 24
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 256-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

23.3 Register States in Each Operating Mode ........................................................................... 845
Section 24 Electrical Characteristics ................................................................. 855
24.1 Absolute Maximum Ratings .............................................................................................. 855
24.2 DC Characteristics ............................................................................................................. 857
24.3 AC Characteristics ............................................................................................................. 859
24.4 Delay Time Variation Due to Load Capacitance ............................................................... 916
Appendix
A.
B.
Index
Rev. 1.00 Dec. 27, 2005 Page xxvi of xlii
24.3.1 Clock Timing ........................................................................................................ 860
24.3.2 Control Signal Timing .......................................................................................... 865
24.3.3 AC Bus Timing..................................................................................................... 868
24.3.4 Basic Timing......................................................................................................... 870
24.3.5 Burst ROM Timing............................................................................................... 874
24.3.6 Synchronous DRAM Timing................................................................................ 875
24.3.7 DMAC Signal Timing .......................................................................................... 901
24.3.8 RTC Signal Timing............................................................................................... 902
24.3.9 SCIF Module Signal Timing................................................................................. 903
24.3.10 SIOF Module Signal Timing ................................................................................ 904
24.3.11 Ethernet Controller Timing................................................................................... 908
24.3.12 Port Input/Output Timing ..................................................................................... 912
24.3.13 H-UDI Related Pin Timing................................................................................... 913
24.3.14 AC Characteristics Measurement Conditions ....................................................... 915
Pin States and States of Unused Pins ................................................................................. 917
Package Dimensions .......................................................................................................... 925
......................................................................................................... 917
......................................................................................................... 929