ATSAM3U4CA-CU Atmel, ATSAM3U4CA-CU Datasheet - Page 367

IC MCU 32BIT 256KB FLSH 100TFBGA

ATSAM3U4CA-CU

Manufacturer Part Number
ATSAM3U4CA-CU
Description
IC MCU 32BIT 256KB FLSH 100TFBGA
Manufacturer
Atmel
Series
SAM3Ur
Datasheets

Specifications of ATSAM3U4CA-CU

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
96MHz
Connectivity
EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
57
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
52K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 4x10b, 4x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TFBGA
Processor Series
ATSAM3x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
52 KB
Interface Type
3xUSART, TWI, 4xSPI, Bus
Maximum Clock Frequency
96 MHz
Number Of Programmable I/os
57
Number Of Timers
8
Operating Supply Voltage
1.62 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ATSAM3U-EK
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATSAM3U4CA-CU
Manufacturer:
Atmel
Quantity:
10 000
Part Number:
ATSAM3U4CA-CU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
25.12 Automatic Wait States
25.12.1
Figure 25-13. Chip Select Wait State between a Read Access on NCS0 and a Write Access on NCS2
6430D–ATARM–25-Mar-11
6430D–ATARM–25-Mar-11
Chip Select Wait States
NBS0, NBS1,
D[15:0]
A[23:2]
A0,A1
NCS0
NCS2
NWE
MCK
NRD
One bit is dedicated to enable/disable NAND Flash scrambling and one bit is dedicated
enable/disable scrambling the off chip SRAM. When at least one external SRAM is scrambled,
the SMSC field must be set in the SMC_OCMS register.
When multiple chip selects (external SRAM) are handled, it is possible to configure the scram-
bling function per chip select using the OCMS field in the SMC_TIMINGS registers.
To scramble the NAND Flash contents, the SRSE field must be set in the SMC_OCMS register.
When NAND Flash memory content is scrambled, the on-chip SRAM page buffer associated for
the transfer is also scrambled.
Under certain circumstances, the SMC automatically inserts idle cycles between accesses to
avoid bus contention or operation conflict.
The SMC always inserts an idle cycle between 2 transfers on separate chip selects. This idle
cycle ensures that there is no bus contention between the de-activation of one device and the
activation of the next one.
During chip select wait state, all control lines are turned inactive: NBS0 to NBS1, NWR0 to
NWR1, NCS[0..3], and NRD lines. They are all set to 1.
Figure 25-13
Select 2.
NRD_CYCLE
illustrates a chip select wait state between access on Chip Select 0 and Chip
Read to Write
Wait State
Chip Select
Wait State
NWE_CYCLE
SAM3U Series
SAM3U Series
367
367

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