ATSAM3U4CA-CU Atmel, ATSAM3U4CA-CU Datasheet - Page 1116

IC MCU 32BIT 256KB FLSH 100TFBGA

ATSAM3U4CA-CU

Manufacturer Part Number
ATSAM3U4CA-CU
Description
IC MCU 32BIT 256KB FLSH 100TFBGA
Manufacturer
Atmel
Series
SAM3Ur
Datasheets

Specifications of ATSAM3U4CA-CU

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
96MHz
Connectivity
EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
57
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
52K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 4x10b, 4x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TFBGA
Processor Series
ATSAM3x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
52 KB
Interface Type
3xUSART, TWI, 4xSPI, Bus
Maximum Clock Frequency
96 MHz
Number Of Programmable I/os
57
Number Of Timers
8
Operating Supply Voltage
1.62 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ATSAM3U-EK
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATSAM3U4CA-CU
Manufacturer:
Atmel
Quantity:
10 000
Part Number:
ATSAM3U4CA-CU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
43.4.6
Table 43-21. 3 to 20 MHz Crystal Oscillator Characteristics
Notes:
Where
1116
Symbol
F
F
T
I
I
P
R
C
C
DD_ON
DD_ST
req
req_bypass
ON
ON
f
LEXT
L
C
1. R
2. Rs = 100-200 Ohms; Cs = 2.0 - 2.5pF; Cm = 2 – 1.5 fF(typ, worst case) using 1 Kohm serial resistor on xout.
3. Rs = 50-100 Ohms; Cs = 2.0 - 2.5pF; Cm = 4 - 3 fF(typ, worst case).
4. Rs = 25-50 Ohms; Cs = 2.5 - 3.0pF; Cm = 7 - 5 fF (typ, worst case).
5. Rs = 20-50 Ohms; Cs = 3.2 - 4.0pF; Cm = 10 - 8 fF(typ, worst case).
PCB
SAM3U Series
3 to 20 MHz Crystal Oscillator Characteristics
is the capacitance of the printed circuit board (PCB) track layout from the crystal to the SAM3U pin.
S
is the series resistor
Parameter
Operating Frequency
Operating Frequency In Bypass Mode
Supply Ripple Voltage (on VDDPLL)
Duty Cycle
Startup Time
Current consumption
Standby Current Consumption
Drive level
Internal resistor
External capacitor on XIN and XOUT
Internal Equivalent Load Capacitance
C
XIN
LEXT
C
LEXT
= 2x(
SAM3U
C
Conditions
Normal mode with crystal
External Clock on XIN
Rms value, 10KHz to 10MHz
3 MHz, C
8 MHz, C
12 to 16 MHz, C
20 MHz, C
3 MHz
8 MHz
12 to 16 MHz
20 MHz
Standby mode @ 3.6V
3 MHz
8 MHz
1 2MHz, 16 MHz, 20 MHz
between XIN and XOUT
Integrated Load Capacitance
(XIN and XOUT in series)
Crystal
C
CRYSTAL
C
L
(2)
(3)
(5)
SHUNT
SHUNT
SHUNT
(4)
R = 1K if Crystal Frequency
C
C
XOUT
= 3pF
= 7pF
LEXT
L
SHUNT
is lower than 8 MHz
= 7pF
C
PCB
= 7pF
).
12.5
Min
7.5
40
3
Typ
150
150
300
400
9.5
16
50
1
Max
14.5
17.5
11.5
250
250
450
550
1.4
20
50
30
60
15
30
50
4
1
5
6430D–ATARM–25-Mar-11
MHz
MHz
Unit
mV
μW
ms
μA
nA
pF
pF
%

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