ATSAM3U4CA-CU Atmel, ATSAM3U4CA-CU Datasheet - Page 1129

• Manufacturer Part Number: ATSAM3U4CA-CU
• Description: IC MCU 32BIT 256KB FLSH 100TFBGA
• Manufacturer: Atmel
• Series: SAM3Ur

Specifications of ATSAM3U4CA-CU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 96MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 57
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 52K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 4x10b, 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TFBGA
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 52 KB
• Interface Type: 3xUSART, TWI, 4xSPI, Bus
• Maximum Clock Frequency: 96 MHz
• Number Of Programmable I/os: 57
• Number Of Timers: 8
• Operating Supply Voltage: 1.62 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3U-EK
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Table 43-46. SPI Timings (Continued)
Notes:
Note that in SPI master mode the SAM3U does not sample the data (MISO) on the opposite edge where data clocks out
(MOSI) but the same edge is used as shown in
43.9.4
43.9.5
6430D–ATARM–25-Mar-11
Symbol
SPI
SPI
SPI
SPI
SPI
SPI
SPI
SPI
SPI
SPI
SPI
SPI
SPI
SPI
SPI
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
1. 3.3V domain: V
2. 1.8V domain: V
MCI Timings
SSC Timings
Parameter
MISO Hold time after SPCK rises (master)
SPCK rising to MOSI Delay (master)
MISO Setup time before SPCK falls (master)
MISO Hold time after SPCK falls (master)
SPCK falling to MOSI Delay (master)
SPCK falling to MISO Delay (slave)
MOSI Setup time before SPCK rises (slave)
MOSI Hold time after SPCK rises (slave)
SPCK rising to MISO Delay (slave)
MOSI Setup time before SPCK falls (slave)
MOSI Hold time after SPCK falls (slave)
NPCS Setup time to SPCK (slave)
NPCS Hold time after SPCK (slave)
NPCS Setup time to SPCK (slave)
NPCS Hold time after SPCK (slave)
VDDIO
VDDIO
The High Speed MultiMedia Card Interface (HSMCI) supports the MultiMedia Card (MMC)
Specification V4.3, the SD Memory Card Specification V2.0, the SDIO V2.0 specification and
CE-ATA V1.1.
Timings are given assuming the following VDDIO supply and load.
VDDIO = 1.62V @25pF
from 3.0V to 3.6V, maximum external capacitor = 30 pF.
from 1.65V to 1.95V, maximum external capacitor = 30 pF.
Figure 43-12
3.3V domain
1.8V domain
3.3V domain
1.8V domain
3.3V domain
1.8V domain
3.3V domain
1.8V domain
3.3V domain
1.8V domain
3.3V domain
1.8V domain
3.3V domain
1.8V domain
3.3V domain
1.8V domain
3.3V domain
1.8V domain
3.3V domain
1.8V domain
3.3V domain
1.8V domain
3.3V domain
1.8V domain
3.3V domain
1.8V domain
3.3V domain
1.8V domain
3.3V domain
1.8V domain
Conditions
and
Figure
(1)
(2)
(1)
(2)
(1)
(2)
(1)
(2)
(1)
(2)
(1)
(2)
(1)
(2)
(1)
(2)
(1)
(2)
(1)
(2)
(1)
(2)
(1)
(2)
(1)
(2)
(1)
(2)
(1)
(2)
43-13.
Min
0.5
0.5
1.5
1.5
5.2
4.2
14
17
0
0
0
0
1
1
0
0
5
0
0
4
0
0
SAM3U Series
Max
3.5
3.5
14
17
14
17
3
3
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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