TMPA901CMXBG Toshiba, TMPA901CMXBG Datasheet - Page 825

• Manufacturer Part Number: TMPA901CMXBG
• Description: Microcontrollers (MCU) 32-bit RISC MCU 16kb ARM926EJ 16kb 200Mhz
• Manufacturer: Toshiba

Specifications of TMPA901CMXBG

• Product Summaries: Summary
• Lead Free: Yes
• Rohs Compatible Product(s): Available
• Rom (kbytes): -
• Rom Type: ROMless
• Ram (kbytes): 32
• Number Of Pins: 177
• Package: BGA
• Vcc: 3V
• Tft Lcd Controller: Y
• Touchscreen Controller: Y
• Usb Host Fs With Phy: Y
• Usb Device Hs With Phy: Y
• Sd Host Controller: -
• Cmos Image Sensor Interface: -
• I2s: 1
• Ssp (ch) Spi: 1
• I2mc/sio (ch): 1
• Uart/sio (ch): 2
• External Bus Interface: Y
• Cs/wait Controller (ch): 4
• Dma Controller: 8
• 10-bit Ad Converter: 4
• 12-bit Da Converter: -
• 16-bit Timer / Counter: 6
• Real Time Clock: Y
• Watchdog Timer: Y
• Osc Freq Detect: Y
• Low-power Modes: Y
• Lead Free Status / Rohs Status: Details

4.
4.1 Absolute Maximum Ratings
Electrical Characteristics
parameter
Solderability
Test
Note 1: Do not exceed the absolute maximum rating of DVCC3IO (SM2-4, SM6,SM7, SN0-2, SP0-5, PA0-3, PB0-3,
Note 2: Do not exceed the absolute maximum rating of DVCCM
Note 3: For PD4-7, VREFH, VREFL the absolute maximum rating of AVCC3AD is applied.
Note 4: For the USB, DDM and DDP- pins, the absolute maximum rating of AVCC3T/3C is applied.
Note 5: The absolute maximum ratings are rated values that must not be exceeded during operation, even for an
AVCC3AD
DVCC3IO
Symbol
DVCC1C
DVCC1A
DVCC1B
AVDD3T
AVDD3C
AVCC3H
T
DVCCM
SOLDER
Σ
T
Σ
T
PC2-4, PC6-7, PN0, PN1, PT0-7, PU0-7, PV0-7)
SH2,SH3,SH4,SH7, SJ0-6, SK0, SK1, SK4, SK5, SL0-2, SL4-SL6)
instant. Any one of the ratings must not be exceeded. If any absolute maximum rating is exceeded, the device
may break down or its performance may be degraded, causing it to catch fire or explode resulting in injury to
the user. Thus, when desigining products that include this device, ensure that no absolute maximum rating
value will ever be exceeded.
Solderability
I
V
I
P
STG
OPR
OH
OL
IOH
IOL
IN
D
Use of Sn-37Pb solder Bath
Solder bath temperature
The number of times
Use of Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature
The number of times
Power supply voltage
Input voltage
Output current (per pin)
Output current (per pin)
Output current (total)
Output current (total)
Power consumption (Ta
Soldering temperature (10s)
Storage temperature
Operating temperature
Parameter
one, Use of R-type flux
one, Use of R-type flux
Test condition
230 C, Dipping time
245 C, Dipping time
TMPA901CM- 824
85ºC)
-0.3 to AVCC3AD+0.3 (Note 3)
-0.3 to DVCC3IO+0.3 (Note 1)
-0.3 to AVDD3C+0.3 (Note 4)
-0.3 to AVDD3T+0.3 (Note 4)
-0.3 to DVCCM+0.3 (Note 2)
5 seconds
5 seconds
-0.3 to AVCC3H+0.3
-0.3 to 3.8
-0.3 to 2.0
-0.3 to 3.8
-65 to 150
-20 to 85
Rating
800
260
-80
80
(SA0-7, SB0-7, SE0-7, SF0-7, SG0-7,
-5
5
Pass:
solderability rate until forming
Unit
mW
mA
mA
mA
mA
Note
V
V
C
C
C
TMPA901CM
2010-07-29
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