DF38602RFT10 Renesas Electronics America, DF38602RFT10 Datasheet - Page 310

MCU 3V 16K 32-QFN

DF38602RFT10

Manufacturer Part Number
DF38602RFT10
Description
MCU 3V 16K 32-QFN
Manufacturer
Renesas Electronics America
Series
H8® H8/300H SLPr
Datasheet

Specifications of DF38602RFT10

Core Processor
H8/300H
Core Size
16-Bit
Speed
10MHz
Connectivity
I²C, IrDA, SCI, SSU
Peripherals
POR, PWM, WDT
Number Of I /o
13
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
32-QFN
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F38602RFT10
HD64F38602RFT10

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF38602RFT10V
Manufacturer:
Renesas Electronics America
Quantity:
135
Section 14 Serial Communication Interface 3 (SCI3, IrDA)
Rev. 3.00 May 15, 2007 Page 276 of 516
REJ09B0152-0300
TXD3 pin
RXD3 pin
TXD3 pin
TDR (next transmit data)
TSR (transmission in progress)
RDR
RSR (reception in progress)
TDR
TSR (transmission in progress)
Figure 14.17 (a) RDRF Setting and RXI Interrupt
Figure 14.17 (b) TDRE Setting and TXI Interrupt
Figure 14.17 (c) TEND Setting and TEI Interrupt
TDRE = 0
RDRF = 0
TEND = 0
TXD3 pin
RXD3 pin
TXD3 pin
(TXI3 request when TIE = 1)
TDR
TSR (transmission completed, transfer)
(RXI3 request when RIE = 1)
RDR
RSR (reception completed, transfer)
(TEI3 request when TEIE = 1)
TDR
TSR (transmission completed)
TDRE
RDRF
TEND
1
1
1

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