LPC1313FBD48,151 NXP Semiconductors, LPC1313FBD48,151 Datasheet - Page 241

• Manufacturer Part Number: LPC1313FBD48,151
• Description: IC MCU 32BIT 32KB FLASH 48LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC13xxr

Specifications of LPC1313FBD48,151

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 48-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I²C, Microwire, SPI, SSI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 42
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC13
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Interface Type: I2C, UART
• Maximum Clock Frequency: 72 MHz
• Number Of Timers: 2
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11041
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: LPC1000
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 72MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 42
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Package: 48LQFP
• Family Name: LPC1000
• Maximum Speed: 72 MHz
• Number Of Programmable I/os: 42
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4918 - KIT DEV FOR LPC1313622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4914; 935289651151

NXP Semiconductors
UM10375
User manual
Fig 37. Texas Instruments Synchronous Serial Frame Format: a) Single and b) Continuous/back-to-back Two
a. Single frame transfer
b. Continuous/back-to-back frames transfer
Frames Transfer
DX/DR
13.8.2.1 Clock Polarity (CPOL) and Phase (CPHA) control
CLK
13.8.2 SPI frame format
FS
For device configured as a master in this mode, CLK and FS are forced LOW, and the
transmit data line DX is in 3-state mode whenever the SSP is idle. Once the bottom entry
of the transmit FIFO contains data, FS is pulsed HIGH for one CLK period. The value to
be transmitted is also transferred from the transmit FIFO to the serial shift register of the
transmit logic. On the next rising edge of CLK, the MSB of the 4-bit to 16-bit data frame is
shifted out on the DX pin. Likewise, the MSB of the received data is shifted onto the DR
pin by the off-chip serial slave device.
Both the SSP and the off-chip serial slave device then clock each data bit into their serial
shifter on the falling edge of each CLK. The received data is transferred from the serial
shifter to the receive FIFO on the first rising edge of CLK after the LSB has been latched.
The SPI interface is a four-wire interface where the SSEL signal behaves as a slave
select. The main feature of the SPI format is that the inactive state and phase of the SCK
signal are programmable through the CPOL and CPHA bits within the SSPCR0 control
register.
When the CPOL clock polarity control bit is LOW, it produces a steady state low value on
the SCK pin. If the CPOL clock polarity control bit is HIGH, a steady state high value is
placed on the CLK pin when data is not being transferred.
DX/DR
CLK
FS
MSB
All information provided in this document is subject to legal disclaimers.
4 to 16 bits
MSB
Rev. 2 — 7 July 2010
LSB
4 to 16 bits
MSB
LSB
4 to 16 bits
Chapter 13: LPC13xx SSP
LSB
UM10375
© NXP B.V. 2010. All rights reserved.
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