LPC1313FBD48,151 NXP Semiconductors, LPC1313FBD48,151 Datasheet - Page 159

• Manufacturer Part Number: LPC1313FBD48,151
• Description: IC MCU 32BIT 32KB FLASH 48LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC13xxr

Specifications of LPC1313FBD48,151

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 48-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I²C, Microwire, SPI, SSI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 42
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC13
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Interface Type: I2C, UART
• Maximum Clock Frequency: 72 MHz
• Number Of Timers: 2
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11041
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: LPC1000
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 72MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 42
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Package: 48LQFP
• Family Name: LPC1000
• Maximum Speed: 72 MHz
• Number Of Programmable I/os: 42
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4918 - KIT DEV FOR LPC1313622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4914; 935289651151

NXP Semiconductors
UM10375
User manual
10.5.5 Human interface device information
Table 180. Mass storage device information class structure
The following structure is used to pass the HID device information:
typedef struct _HID_DEVICE_INFO {
} HID_DEVICE_INFO;
Table 181. Human interface device information class structure
Member
MemorySize
MSC_Write
MSC_Read
Member
idVendor
idProduct
bcdDevice
StrDescPtr
InReportCount
OutReportCount
uint16_t
uint16_t
uint16_t
uint32_t StrDescPtr;
uint8_t
uint8_t
uint8_t
void (*InReport)( uint8_t src[], uint32_t length);
void (*OutReport)(uint8_t dst[], uint32_t length);
InReportCount;
OutReportCount;
SampleInterval;
idVendor;
idProduct;
bcdDevice;
All information provided in this document is subject to legal disclaimers.
Description
Memory size in number of bytes
Write call back function. This function is provided by the application software.
This function gets called when host sends a write command.
Input Parameters:
Offset – Destination start address
Source Pointer – Pointer to the source of data
Length – Number of bytes to be written
Read call back function. This function is provided by the application software.
This function gets called when host sends a read command.
Input Parameters:
Offset – Destination start address
Destination Pointer – Pointer to the destination of data
Length – Number of bytes to be read
Description
Vendor ID
Product ID
Device release number
Pointer to the String Describing the Manufacturer, Product and Serial
number. Refer to
Number of bytes in InReport
Number of bytes in OutReport
Rev. 2 — 7 July 2010
Section 10.6.4
Chapter 10: LPC13xx USB on-chip drivers
for an example.
UM10375
© NXP B.V. 2010. All rights reserved.
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