LPC1313FBD48,151 NXP Semiconductors, LPC1313FBD48,151 Datasheet - Page 159
![IC MCU 32BIT 32KB FLASH 48LQFP](/photos/6/64/66484/568-48-lqfp_sot313-2_sml.jpg)
LPC1313FBD48,151
Manufacturer Part Number
LPC1313FBD48,151
Description
IC MCU 32BIT 32KB FLASH 48LQFP
Manufacturer
NXP Semiconductors
Series
LPC13xxr
Specifications of LPC1313FBD48,151
Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
48-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
I²C, Microwire, SPI, SSI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
42
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC13
Core
ARM Cortex M3
Data Bus Width
32 bit
Interface Type
I2C, UART
Maximum Clock Frequency
72 MHz
Number Of Timers
2
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
OM11041
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
LPC1000
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Total Internal Ram Size
8KB
# I/os (max)
42
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
LQFP
Package
48LQFP
Family Name
LPC1000
Maximum Speed
72 MHz
Number Of Programmable I/os
42
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4918 - KIT DEV FOR LPC1313622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4914
935289651151
935289651151
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1313FBD48,151
Manufacturer:
MAXIM
Quantity:
1 560
Company:
Part Number:
LPC1313FBD48,151
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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UM10375
User manual
10.5.5 Human interface device information
Table 180. Mass storage device information class structure
The following structure is used to pass the HID device information:
typedef struct _HID_DEVICE_INFO {
} HID_DEVICE_INFO;
Table 181. Human interface device information class structure
Member
MemorySize
MSC_Write
MSC_Read
Member
idVendor
idProduct
bcdDevice
StrDescPtr
InReportCount
OutReportCount
uint16_t
uint16_t
uint16_t
uint32_t StrDescPtr;
uint8_t
uint8_t
uint8_t
void (*InReport)( uint8_t src[], uint32_t length);
void (*OutReport)(uint8_t dst[], uint32_t length);
InReportCount;
OutReportCount;
SampleInterval;
idVendor;
idProduct;
bcdDevice;
All information provided in this document is subject to legal disclaimers.
Description
Memory size in number of bytes
Write call back function. This function is provided by the application software.
This function gets called when host sends a write command.
Input Parameters:
Offset – Destination start address
Source Pointer – Pointer to the source of data
Length – Number of bytes to be written
Read call back function. This function is provided by the application software.
This function gets called when host sends a read command.
Input Parameters:
Offset – Destination start address
Destination Pointer – Pointer to the destination of data
Length – Number of bytes to be read
Description
Vendor ID
Product ID
Device release number
Pointer to the String Describing the Manufacturer, Product and Serial
number. Refer to
Number of bytes in InReport
Number of bytes in OutReport
Rev. 2 — 7 July 2010
Section 10.6.4
Chapter 10: LPC13xx USB on-chip drivers
for an example.
UM10375
© NXP B.V. 2010. All rights reserved.
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