LPC1313FBD48,151 NXP Semiconductors, LPC1313FBD48,151 Datasheet - Page 158

• Manufacturer Part Number: LPC1313FBD48,151
• Description: IC MCU 32BIT 32KB FLASH 48LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC13xxr

Specifications of LPC1313FBD48,151

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 48-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I²C, Microwire, SPI, SSI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 42
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC13
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Interface Type: I2C, UART
• Maximum Clock Frequency: 72 MHz
• Number Of Timers: 2
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11041
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: LPC1000
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 72MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 42
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Package: 48LQFP
• Family Name: LPC1000
• Maximum Speed: 72 MHz
• Number Of Programmable I/os: 42
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4918 - KIT DEV FOR LPC1313622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4914; 935289651151

NXP Semiconductors
UM10375
User manual
10.5.4 Mass storage device information
Table 179. USB device information class structure
The following structure is used to pass the MSC device information:
typedef struct _MSC_DEVICE_INFO {
} MSC_DEVICE_INFO;
Table 180. Mass storage device information class structure
Member
DevType
DevDetailPtr
Member
idVendor
idProduct
bcdDevice
StrDescPtr
MSCInquiryStr
BlockCount
BlockSize
uint16_t
uint16_t
uint16_t
uint32_t StrDescPtr;
uint32_t MSCInquiryStr;
uint32_t BlockCount;
uint32_t BlockSize;
uint32_t MemorySize;
void (*MSC_Write)( uint32_t offset, uint8_t src[], uint32_t length);
void (*MSC_Read)( uint32_t offset, uint8_t dst[], uint32_t length);
idVendor;
idProduct;
bcdDevice;
All information provided in this document is subject to legal disclaimers.
Description
USB device class type
USB_DEVICE_CLASS_HUMAN_INTERFACE(0x03)
USB_DEVICE_CLASS_STORAGE(0x08)
Pointer to the device information structure
Description
Vendor ID
Product ID
Device release number
Pointer to the String Describing the Manufacturer, Product and Serial number.
Refer to
Pointer to the 28 character string. This string is sent in response to the SCSI
Inquiry command
Number of blocks present in the mass storage device
Block size in number of bytes
Rev. 2 — 7 July 2010
Section 10.6.4
for an example.
Chapter 10: LPC13xx USB on-chip drivers
UM10375
© NXP B.V. 2010. All rights reserved.
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