MC68302EH16C Freescale Semiconductor, MC68302EH16C Datasheet - Page 339
MC68302EH16C
Manufacturer Part Number
MC68302EH16C
Description
IC MPU MULTI-PROTOCOL 132-PQFP
Manufacturer
Freescale Semiconductor
Datasheets
1.MC68302AG20C.pdf
(4 pages)
2.MC68302AG20C.pdf
(2 pages)
3.MC68302AG20C.pdf
(13 pages)
4.MC68302EH16C.pdf
(481 pages)
Specifications of MC68302EH16C
Processor Type
M683xx 32-Bit
Speed
16MHz
Voltage
5V
Mounting Type
Surface Mount
Package / Case
132-MQFP, 132-PQFP
Controller Family/series
68K
Core Size
32 Bit
Ram Memory Size
1152Byte
Cpu Speed
16MHz
No. Of Timers
3
Embedded Interface Type
SCP, TDM
Digital Ic Case Style
PQFP
Rohs Compliant
Yes
Family Name
M68000
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
16MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
5V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
132
Package Type
PQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
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- MC68302AG20C PDF datasheet
- MC68302AG20C PDF datasheet #2
- MC68302AG20C PDF datasheet #3
- MC68302EH16C PDF datasheet #4
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APPENDIX B
DEVELOPMENT TOOLS AND SUPPORT
B.1 MOTOROLA SOFTWARE OVERVIEW
A software development package is offered as a set of independent modules which provides
the following features:
B.2 MOTOROLA SOFTWARE MODULES
Chip driver routines written in C illustrate initialization of the IMP, interrupt handling, and the
management of data transmission and reception on all channels.
In addition to the chip drivers, protocol modules are provided. Layer 2 modules include
LAPB and LAPD. (Support for layer 2 BlSYNC and DDCMP functions are also provided with
the chip driver package.) The layer 3 module supported is the X.25 packet layer protocol.
Since the modules do require some minimal operating system services, they are written to
use our EDX operating system. Use of EDX with the protocol modules is not required as long
as some other operating system support is provided by the user.
All modules communicate with each other using message passing. This technique simplifies
the interfaces between the different modules and enables them to interface with other user-
added modules with relative ease. Detailed descriptions of the software interfaces are avail-
able.
MOTOROLA
• IMP Chip Evaluation
• IMP Chip Drivers
• Protocol Implementations
• Portability
A development board, described in B.5 302 Family ADS System, can be used as a pro-
totyping vehicle for user code.
Written in C, the source code of the IMP drivers is available on electronic media. These
drivers were developed to support the needs of the protocol implementations described
below.
license. These are in the form of binary relocatable object code as well as source code
written in C.
All of the modules may be ported to different MC68302 implementations and combined
with user-developed code. Well-defined software interface documentation is available
for all provided modules.
Modules implementing common ISO/OSI layer 2 and 3 protocols are available under
MC68302 USER’S MANUAL
B-1
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