MMC2114CFCAG33 Freescale Semiconductor, MMC2114CFCAG33 Datasheet - Page 645

• Manufacturer Part Number: MMC2114CFCAG33
• Description: IC MCU 32BIT 33MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCorer

Specifications of MMC2114CFCAG33

• Core Processor: M210
• Core Size: 32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: MMC2114
• Core: M-CORE
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Controller Family/series: MCORE
• No. Of I/o's: 104
• Ram Memory Size: 32KB
• Cpu Speed: 33MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

24.9 196-Ball MAPBGA Mechanical Drawing
MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
MOTOROLA
196X
3
13X
Y
E
X
S
0.15
0.08
e
b
M
M
1413121110 9
0.15
Z
Z
LASER MARK FOR
PIN A1 IDENTIFICATION
IN THIS AREA
X
S
VIEW M-M
Y
D
6 5 4 3 2 1
13X
e
Freescale Semiconductor, Inc.
M
A
C
D
G
H
K
N
B
E
F
J
L
P
For More Information On This Product,
METALIZED MARK FOR PIN A1
IDENTIFICATION IN THISAREA
Go to: www.freescale.com
Mechanical Specifications
A
A1
K
A2
M
M
ROTATED 90 CLOCKWISE
DETAIL K
4
Z
196-Ball MAPBGA Mechanical Drawing
NOTES:
1.
2.
3.
4.
5.
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS INND
TOLERANCES PER ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
DIM
A1
A2
A
b
D
E
e
S
196X
5
0.20
MILLIMETERS
MIN
1.25
0.27
0.45
0.10
15.00 BSC
15.00 BSC
1.16 REF
1.00 BSC
0.50 BSC
Z
Mechanical Specifications
Z
MAX
1.60
0.47
0.55
Advance Information
645