MMC2114CFCAG33 Freescale Semiconductor, MMC2114CFCAG33 Datasheet - Page 645
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
MMC2114CFCAG33
Manufacturer Part Number
MMC2114CFCAG33
Description
IC MCU 32BIT 33MHZ 144-LQFP
Manufacturer
Freescale Semiconductor
Series
MCorer
Specifications of MMC2114CFCAG33
Core Processor
M210
Core Size
32-Bit
Speed
33MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
MMC2114
Core
M-CORE
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
33 MHz
Number Of Programmable I/os
104
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Controller Family/series
MCORE
No. Of I/o's
104
Ram Memory Size
32KB
Cpu Speed
33MHz
No. Of Timers
2
Embedded Interface Type
SCI, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MMC2114CFCAG33
Manufacturer:
Freescale Semiconductor
Quantity:
135
Company:
Part Number:
MMC2114CFCAG33
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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24.9 196-Ball MAPBGA Mechanical Drawing
MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
MOTOROLA
196X
3
13X
Y
E
X
S
0.15
0.08
e
b
M
M
1413121110 9
0.15
Z
Z
LASER MARK FOR
PIN A1 IDENTIFICATION
IN THIS AREA
X
S
VIEW M-M
Y
D
6 5 4 3 2 1
13X
e
Freescale Semiconductor, Inc.
M
A
C
D
G
H
K
N
B
E
F
J
L
P
For More Information On This Product,
METALIZED MARK FOR PIN A1
IDENTIFICATION IN THISAREA
Go to: www.freescale.com
Mechanical Specifications
A
A1
K
A2
M
M
ROTATED 90 CLOCKWISE
DETAIL K
4
Z
196-Ball MAPBGA Mechanical Drawing
NOTES:
1.
2.
3.
4.
5.
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS INND
TOLERANCES PER ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
DIM
A1
A2
A
b
D
E
e
S
196X
5
0.20
MILLIMETERS
MIN
1.25
0.27
0.45
0.10
15.00 BSC
15.00 BSC
1.16 REF
1.00 BSC
0.50 BSC
Z
Mechanical Specifications
Z
MAX
1.60
0.47
0.55
Advance Information
645
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