MMC2114CFCAG33 Freescale Semiconductor, MMC2114CFCAG33 Datasheet - Page 615
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MMC2114CFCAG33
Manufacturer Part Number
MMC2114CFCAG33
Description
IC MCU 32BIT 33MHZ 144-LQFP
Manufacturer
Freescale Semiconductor
Series
MCorer
Specifications of MMC2114CFCAG33
Core Processor
M210
Core Size
32-Bit
Speed
33MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
MMC2114
Core
M-CORE
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
33 MHz
Number Of Programmable I/os
104
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Controller Family/series
MCORE
No. Of I/o's
104
Ram Memory Size
32KB
Cpu Speed
33MHz
No. Of Timers
2
Embedded Interface Type
SCI, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MMC2114CFCAG33
Manufacturer:
Freescale Semiconductor
Quantity:
135
Company:
Part Number:
MMC2114CFCAG33
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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23.6 Electrostatic Discharge (ESD) Protection
MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
MOTOROLA
ESD target for human body model
ESD target for machine model
HBM circuit description
MM circuit description
Number of pulses per pin (HBM)
Number of pulses per pin (MM)
Interval of pulses
1. All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive
2. A device will be defined as a failure if after exposure to ESD pulses the device no longer
Positive pulses
Negative pulses
Positive pulses
Negative pulses
Freescale Semiconductor, Inc.
Grade Integrated Circuits.
meets the device specification requirements. Complete DC parametric and functional testing
shall be performed per applicable device specification at room temperature followed by hot
temperature, unless specified otherwise in the device specification.
For More Information On This Product,
Preliminary Electrical Specifications
Go to: www.freescale.com
Table 23-3. ESD Protection Characteristics
Parameter
(1)
Ã
(2)
Electrostatic Discharge (ESD) Protection
Preliminary Electrical Specifications
Symbol
R
R
HBM
MM
Series
Series
—
—
—
C
C
Advance Information
Value
2000
1500
200
100
200
0
1
1
3
3
1
Units
Sec
pF
pF
—
—
W
W
V
V
615
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