MMC2114CFCAG33 Freescale Semiconductor, MMC2114CFCAG33 Datasheet - Page 517

• Manufacturer Part Number: MMC2114CFCAG33
• Description: IC MCU 32BIT 33MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCorer

Specifications of MMC2114CFCAG33

• Core Processor: M210
• Core Size: 32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: MMC2114
• Core: M-CORE
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Controller Family/series: MCORE
• No. Of I/o's: 104
• Ram Memory Size: 32KB
• Cpu Speed: 33MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

19.11.5 Accommodating Positive/Negative Stress Conditions
MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
MOTOROLA
Other suggestions for PCB layout in which the QADC is employed
include:
Positive or negative stress refers to conditions which exceed nominally
defined operating limits. Examples include applying a voltage exceeding
the normal limit on an input (for example, voltages outside of the
suggested supply/reference ranges) or causing currents into or out of
the pin which exceed normal limits. QADC specific considerations are
voltages greater than V
which cause excessive currents into or out of the input. Refer to
Table 23-6. QADC Absolute Maximum Ratings
QADC Electrical Specifications (Operating)
exact magnitudes.
Either stress conditions can potentially disrupt conversion results on
neighboring inputs. Parasitic devices, associated with CMOS
processes, can cause an immediate disruptive influence on neighboring
pins. Common examples of parasitic devices are diodes to substrate and
bipolar devices with the base terminal tied to substrate (V
ground). Under stress conditions, current injected on an adjacent pin can
cause errors on the selected channel by developing a voltage drop
across the selected channel’s impedances.
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Freescale Semiconductor, Inc.
For More Information On This Product,
Queued Analog-to-Digital Converter (QADC)
Analog ground must be low impedance to all analog ground points
in the circuit.
Bypass capacitors should be as close to the power pins as
possible.
The analog ground should be isolated from the digital ground. This
can be done by cutting a separate ground plane for the analog
ground.
Non-minimum traces should be utilized for connecting bypass
capacitors and filters to their corresponding ground/power points.
Minimum distance for trace runs when possible.
Go to: www.freescale.com
DDA
or less than V
Queued Analog-to-Digital Converter (QADC)
SSA
applied to an analog input
Pin Connection Considerations
for more information on
and
Advance Information
Table 23-7.
SS
/V
SSA
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