MMC2114CFCAG33 Freescale Semiconductor, MMC2114CFCAG33 Datasheet - Page 622

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MMC2114CFCAG33

Manufacturer Part Number
MMC2114CFCAG33
Description
IC MCU 32BIT 33MHZ 144-LQFP
Manufacturer
Freescale Semiconductor
Series
MCorer
Datasheets

Specifications of MMC2114CFCAG33

Core Processor
M210
Core Size
32-Bit
Speed
33MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
MMC2114
Core
M-CORE
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
33 MHz
Number Of Programmable I/os
104
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Controller Family/series
MCORE
No. Of I/o's
104
Ram Memory Size
32KB
Cpu Speed
33MHz
No. Of Timers
2
Embedded Interface Type
SCI, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Preliminary Electrical Specifications
Advance Information
622
QADC clock (QCLK) frequency
Conversion cycles
Conversion time
Stop mode recovery time
Resolution
Absolute (total unadjusted) error
Disruptive input injection current
Current Coupling Ratio
Incremental error due to injection current
Source impedance at input
Incremental capacitance during sampling
f
Min = CCW/IST =%00
Max = CCW/IST =%11
f
Two clock input sample time
PQA
PQB
All channels have same 10 k < R
Channel under test has R
I
1. Conversion characteristics vary with f
2. At V
3. Accuracy tested and guaranteed at V
4. This parameter is characterized before qualification rather than 100% tested.
5. Absolute error includes 1/2 count (~2.5 mV) of inherent quantization error and circuit (differential, integral, and offset) error.
6. Input signals with large slew rates or high frequency noise components cannot be converted accurately. These signals may
QCLK
QCLK
INJ
pins as GPIO functions during conversions may result in degraded results.
Specification assumes that adequate low-pass filtering is present on analog input pins — capacitive filter with 0.01 F to
0.1 F capacitor between analog input and analog ground, typical source isolation impedance of 10 K .
affect the conversion accuracy of other channels.
= I
V
RH
= 2.0 MHz
= 2.0 MHz
INJMAX
RH
(V
–V
(2)
– V
DDH
RL
RL
, I
INJMIN
and V
= 5.12 V, one count = 5 mV
= 5 Vdc ± 0.5 V, T
(1)
(2)
Parameter
Table 23-8. QADC Conversion Specifications (Operating)
(11)
DDA
S
(13)
= 10k,
= 5.0 Vdc
(1)
Freescale Semiconductor, Inc.
(7), (8), (9)
(3), (4), (5), (6)
For More Information On This Product,
S
< 100k
QCLK
RH
Preliminary Electrical Specifications
A
–V
(12)
(14)
within operating temperature range, f
rate. Reduced conversion accuracy occurs at max f
RL
Go to: www.freescale.com
0.5 V, V
= 5.0 V ± 0.5 V
DD
Symbol
C
I
t
f
INJ
CONV
QCLK
E
SAMP
= 2.7 to 3.6 V V
CC
t
AE
R
SR
K
INJ
(10)
S
MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
Min
0.5
7.0
14
–2
–1
5
SS
Notes continued on next page
and V
8x10
8x10
QCLK
SSA
Max
14.0
+1.0
+1.0
100
2.1
28
10
sys
2
1
5
–5
–5
rate. Using the QADC
= 0 Vdc,
= 16 MHz)
MOTOROLA
Counts
Counts
Counts
QCLK
cycles
Unit
MHz
mV
mA
k
pF
s
s

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