TMPM330FWFG Toshiba, TMPM330FWFG Datasheet - Page 487

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TMPM330FWFG

Manufacturer Part Number
TMPM330FWFG
Description
Microcontrollers (MCU) MCU w/ ARM Cortex-M3 128K FLASH, 8K SRAM
Manufacturer
Toshiba
Datasheets

Specifications of TMPM330FWFG

Processor Series
TX03
Core
ARM Cortex M3
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Product Summaries
Summary
Lead Free
Yes
Rohs Compatible Product(s)
Available
Rom (kbytes)
128K
Rom Type
Flash
Ram (kbytes)
8K
Number Of Pins
100
Package
LQFP(14×14)
Vcc
3V
Cpu Mhz
40
Ssp (ch) Spi
-
I2c/sio (ch)
3
Uart/sio (ch)
3
Usb
-
Can
-
Ethernet
-
External Bus Interface
-
Cs/wait Controller (ch)
-
Dma Controller
-
10-bit Da Converter
-
10-bit Ad Converter
12
12-bit Ad Converter
-
16-bit Timer / Counter
10
Motor / Igbt Control
-
Real Time Clock
1
Watchdog Timer
Y
Osc Freq Detect
-
Clock Gear
Y
Low-power Hold Function
-
Remote Control Interface
Y
Hardware Cec Controller
Y
Comparators
-
Low-voltage Detector
-
Etm Hardware Trace
4-bit
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TMPM330FWFG
Manufacturer:
Toshiba
Quantity:
10 000
21.6 Recommended Oscillation Circuit
(1) Connection example
(2) Recommended ceramic oscillator
(3) Recommended ceramic oscillator
(Note)The load value of the oscillator is the sum of loads (C1 and C2) and the floating load of the
selecting external parts.
The TMPM330 has been evaluated by the oscillator vender below. Use this information when
The TMPM330 recommends the high-frequency oscillator by Murata Manufacturing Co., Ltd.
Please refer to the following URL for details.
http://www.murata.co.jp
The TMPM330 recommends the high-frequency oscillator by KYOCERA KINSEKI Corporation.
Please refer to the following URL for details.
http://www.kinseki.co.jp
actual assembled board. There is a possibility of operating error when using C1 and C2
values in the table below. When designing the board, design the minimum length pattern
around the oscillator. We also recommend that oscillator evaluation be carried out using
the actual board.
Fig. 21-1 High-frequency oscillation connection
C1
X1
Under development
Page475
C2
X2
Rd
TMPM330

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