HD64F2612FA20 Renesas Electronics America, HD64F2612FA20 Datasheet - Page 597

IC H8S MCU FLASH 128K 80QFP

HD64F2612FA20

Manufacturer Part Number
HD64F2612FA20
Description
IC H8S MCU FLASH 128K 80QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2612FA20

Core Processor
H8S/2600
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
43
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
80-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2612FA20
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Part Number:
HD64F2612FA20J
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
D.
The package dimension that is shown in the Renesas Semiconductor Package Data Book has
priority.
JEITA Package Code
P-QFP80-14x14-0.65
61
80
Package Dimensions
e
60
1
Z
D
*1
H
D
RENESAS Code
PRQP0080JD-A
D
Figure D.1 FP-80Q, FP-80QV Package Dimensions
y
*3
b
p
41
20
x
40
21
FP-80Q/FP-80QV
Previous Code
M
F
MASS[Typ.]
1.2g
Rev. 7.00 Sep. 11, 2009 Page 561 of 566
Terminal cross section
Detail F
b
b
p
1
NOTE)
1. DIMENSIONS"*1"AND"*2"
2. DIMENSION"*3"DOES NOT
L
DO NOT INCLUDE MOLD FLASH
INCLUDE TRIM OFFSET.
1
L
θ
REJ09B0211-0700
Reference
Symbol
D
E
A
H
H
A
A
b
b
c
c
e
x
y
Z
Z
L
L
θ
2
D
E
1
p
1
1
D
E
1
17.0
17.0
0.00
0.24
0.12
Min
0.6
0 °
Dimension in Millimeters
Appendix
Nom
2.70
17.2
17.2
0.10
0.32
0.30
0.17
0.15
0.65
0.83
0.83
14
14
0.8
1.6
Max
17.4
17.4
3.05
0.25
0.40
0.22
0.12
0.10
1.0
8 °

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