HD64F2612FA20 Renesas Electronics America, HD64F2612FA20 Datasheet - Page 23

• Manufacturer Part Number: HD64F2612FA20
• Description: IC H8S MCU FLASH 128K 80QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2612FA20

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: CAN, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 43
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 80-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

20.4 Software Standby Mode..................................................................................................... 496
20.5 Hardware Standby Mode ................................................................................................... 499
20.6 Module Stop Mode............................................................................................................. 500
20.7 φ Clock Output Disabling Function ................................................................................... 501
20.8 Usage Notes ....................................................................................................................... 502
Section 21 Electrical Characteristics .................................................................503
21.1 Absolute Maximum Ratings .............................................................................................. 503
21.2 DC Characteristics ............................................................................................................. 504
21.3 AC Characteristics ............................................................................................................. 507
21.4 A/D Conversion Characteristics......................................................................................... 516
21.5 Flash Memory Characteristics............................................................................................ 517
Appendix
A.
B.
C.
D.
Index
20.3.2 Clearing Sleep Mode............................................................................................. 495
20.4.1 Transition to Software Standby Mode .................................................................. 496
20.4.2 Clearing Software Standby Mode ......................................................................... 496
20.4.3 Setting Oscillation Stabilization Time after Clearing Software Standby Mode.... 497
20.4.4 Software Standby Mode Application Example..................................................... 498
20.5.1 Transition to Hardware Standby Mode ................................................................. 499
20.5.2 Clearing Hardware Standby Mode........................................................................ 499
20.5.3 Hardware Standby Mode Timings ........................................................................ 499
20.8.1 I/O Port Status....................................................................................................... 502
20.8.2 Current Dissipation during Oscillation Stabilization Wait Period ........................ 502
20.8.3 DTC Module Stop................................................................................................. 502
20.8.4 On-Chip Supporting Module Interrupt.................................................................. 502
20.8.5 Writing to MSTPCR ............................................................................................. 502
21.3.1 Clock Timing ........................................................................................................ 508
21.3.2 Control Signal Timing .......................................................................................... 509
21.3.3 Timing of On-Chip Supporting Modules.............................................................. 511
On-Chip I/O Register ......................................................................................................... 519
A.1
A.2
A.3
I/O Port States in Each Pin State........................................................................................ 559
Product Code Lineup ......................................................................................................... 560
Package Dimensions .......................................................................................................... 561
..........................................................................................................519
Register Addresses................................................................................................ 519
Register Bits.......................................................................................................... 534
Register States in Each Operating Mode .............................................................. 548
..........................................................................................................563
Rev. 7.00 Sep. 11, 2009 Page xxi of xxxiv
REJ09B0211-0700