HD64F2612FA20 Renesas Electronics America, HD64F2612FA20 Datasheet - Page 489

• Manufacturer Part Number: HD64F2612FA20
• Description: IC H8S MCU FLASH 128K 80QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2612FA20

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: CAN, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 43
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 80-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

The features of the flash memory are summarized below.
The block diagram of the flash memory is shown in figure 18.1.
18.1
• Size: 128 kbytes
• Programming/erase methods
• Reprogramming capability
• Three programming modes
• Programmer mode
• Automatic bit rate adjustment
• Programming/erasing protection
⎯ The flash memory is programmed 128 bytes at a time. Erase is performed in single-block
⎯ The flash memory can be reprogrammed up to 100 times.
⎯ Boot mode
⎯ User mode
⎯ Programmer mode
On-board programming/erasing can be done in boot mode, in which the boot program built
into the chip is started to erase or program of the entire flash memory. In normal user program
mode, individual blocks can be erased or programmed.
⎯ Flash memory can be programmed/erased in programmer mode using a PROM
⎯ For data transfer in boot mode, this LSI's bit rate can be automatically adjusted to match
⎯ Sets software protection against flash memory programming/erasing.
units. The flash memory is configured as follows: 32 kbytes × 2 blocks, 28 kbytes × 1
block, 16 kbytes × 1 block, 8 kbytes × 2 blocks, and 1 kbyte × 4 blocks. To erase the entire
flash memory, each block must be erased in turn.
programmer, as well as in on-board programming mode.
the transfer bit rate of the host.
Features
Section 18 ROM
Rev. 7.00 Sep. 11, 2009 Page 453 of 566
REJ09B0211-0700
Section 18 ROM