HD64F2612FA20 Renesas Electronics America, HD64F2612FA20 Datasheet - Page 21

• Manufacturer Part Number: HD64F2612FA20
• Description: IC H8S MCU FLASH 128K 80QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2612FA20

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: CAN, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 43
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 80-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 16 A/D Converter..................................................................................435
16.1 Features .............................................................................................................................. 435
16.2 Input/Output Pins ............................................................................................................... 437
16.3 Register Description........................................................................................................... 438
16.4 Operation............................................................................................................................ 442
16.5 Interrupts ............................................................................................................................ 445
16.6 A/D Conversion Precision Definitions............................................................................... 446
16.7 Usage Notes ....................................................................................................................... 448
Section 17 RAM ................................................................................................451
Section 18 ROM ................................................................................................453
18.1 Features .............................................................................................................................. 453
18.2 Mode Transitions ............................................................................................................... 454
18.3 Block Configuration........................................................................................................... 458
18.4 Input/Output Pins ............................................................................................................... 459
18.5 Register Descriptions ......................................................................................................... 459
15.8.5 Error Counters....................................................................................................... 431
15.8.6 Register Access..................................................................................................... 431
15.8.7 HCAN Medium-Speed Mode ............................................................................... 431
15.8.8 Register Hold in Standby Modes .......................................................................... 431
15.8.9 Usage of Bit Manipulation Instructions ................................................................ 431
15.8.10 HCAN TXCR Operation....................................................................................... 432
15.8.11 HCAN Transmit Procedure................................................................................... 433
15.8.12 Note on Releasing the HCAN Reset or HCAN Sleep........................................... 433
15.8.13 Note on Accessing Mailbox during the HCAN Sleep........................................... 433
16.3.1 A/D Data Registers A to D (ADDRA to ADDRD) .............................................. 438
16.3.2 A/D Control/Status Register (ADCSR) ................................................................ 439
16.3.3 A/D Control Register (ADCR) ............................................................................. 441
16.4.1 Single Mode.......................................................................................................... 442
16.4.2 Scan Mode ............................................................................................................ 442
16.4.3 Input Sampling and A/D Conversion Time........................................................... 443
16.4.4 External Trigger Input Timing.............................................................................. 445
16.7.1 Module Stop Mode Setting ................................................................................... 448
16.7.2 Permissible Signal Source Impedance .................................................................. 448
16.7.3 Influences on Absolute Precision.......................................................................... 448
16.7.4 Range of Analog Power Supply and Other Pin Settings ....................................... 449
16.7.5 Notes on Board Design ......................................................................................... 449
16.7.6 Notes on Noise Countermeasures ......................................................................... 449
18.5.1 Flash Memory Control Register 1 (FLMCR1)...................................................... 459
Rev. 7.00 Sep. 11, 2009 Page xix of xxxiv
REJ09B0211-0700