HD64F2612FA20 Renesas Electronics America, HD64F2612FA20 Datasheet - Page 491

IC H8S MCU FLASH 128K 80QFP

HD64F2612FA20

Manufacturer Part Number
HD64F2612FA20
Description
IC H8S MCU FLASH 128K 80QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2612FA20

Core Processor
H8S/2600
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
43
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
80-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2612FA20
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Part Number:
HD64F2612FA20J
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Figure 18.3 shows the operation flow for boot mode and figure 18.4 shows that for user program
mode.
Table 18.1 Differences between Boot Mode and User Program Mode
Total erase
Block erase
Programming control program *
(1) Erase/erase-verify
(2) Program/program-verify
(3) Emulation
Note:
* To be provided by the user, in accordance with the recommended algorithm.
Notes: Only make a transition between user mode and user program mode when the CPU is
FWE = 1
(on-chip ROM
User mode
enabled)
not accessing the flash memory.
1. RAM emulation possible
2. This LSI transits to programmer mode by using the dedicated PROM programmer.
On-board programming mode
program mode
FWE = 0
Figure 18.2 Flash Memory State Transitions
*
User
1
MD1 = 1,
MD2 = 1,
FWE = 0
MD1 = 1,
MD2 = 1,
FWE = 1
*
RES = 0
1
Boot Mode
Yes
No
(2)
RES = 0
MD2 = 0,
MD1 = 1,
FWE = 1
Reset state
Boot mode
Rev. 7.00 Sep. 11, 2009 Page 455 of 566
RES = 0
*
User Program Mode
Yes
Yes
(1) (2) (3)
2
RES = 0
Programmer
mode
REJ09B0211-0700
Section 18 ROM

Related parts for HD64F2612FA20