LPC2458FET180,551 NXP Semiconductors, LPC2458FET180,551 Datasheet - Page 73

• Manufacturer Part Number: LPC2458FET180,551
• Description: IC ARM7 MCU FLASH 512K 180TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2458FET180,551

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 136
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 180-TFBGA
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN, Ethernet, I2C, I2S, IrDA, SPI, SSP, UART, USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 136
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA180
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• On-chip Dac: 10 bit, 1 Channel
• Package: 180TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• For Use With: 622-1023 - BOARD SCKT ADAPTER FOR TFBGA180622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-4258; 935282454551; LPC2458FET180-S

NXP Semiconductors
7. Memory bank select
UM10237_4
User manual
6.1 Low-power SDRAM Deep-sleep Mode
6.2 Low-power SDRAM partial array refresh
Self-refresh mode can be entered by software by setting the SREFREQ bit in the
EMCDynamicControl Register and polling the SREFACK bit in the EMCStatus Register.
Any transactions to memory that are generated while the memory controller is in
self-refresh mode are rejected and an error response is generated to the AHB bus.
Clearing the SREFREQ bit in the EMCDynamicControl Register returns the memory to
normal operation. See the memory data sheet for refresh requirements.
Note: The static memory can be accessed as normal when the SDRAM memory is in
self-refresh mode.
The EMC supports JEDEC low-power SDRAM deep-sleep mode. Deep-sleep mode can
be entered by setting the deep-sleep mode (DP) bit, the dynamic memory clock enable bit
(CE), and the dynamic clock control bit (CS) in the EMCDynamicControl register. The
device is then put into a low-power mode where the device is powered down and no
longer refreshed. All data in the memory is lost.
The EMC supports JEDEC low-power SDRAM partial array refresh. Partial array refresh
can be programmed by initializing the SDRAM memory device appropriately. When the
memory device is put into self-refresh mode only the memory banks specified are
refreshed. The memory banks that are not refreshed lose their data contents.
Eight independently-configurable memory chip selects are supported:
Static memory chip select ranges are each 16 megabytes in size, while dynamic memory
chip selects cover a range of 256 megabytes each.
of the chip selects.
Table 65.
[1]
Chip select pin
CS0
CS1
CS2
CS3
DYCS0
DYCS1
DYCS2
DYCS3
•
•
Pins CSn3 to CSn0 are used to select static memory devices.
Pins DYCSn3 to DYCSn0 are used to select dynamic memory devices.
For LPC2458, see
Memory bank selection
Address range
0x8000 0000 - 0x80FF FFFF
0x8100 0000 - 0x81FF FFFF
0x8200 0000 - 0x82FF FFFF
0x8300 0000 - 0x83FF FFFF
0xA000 0000 - 0xAFFF FFFF
0xB000 0000 - 0xBFFF FFFF
0xC000 0000 - 0xCFFF FFFF
0xD000 0000 - 0xDFFF FFFF
Table
Rev. 04 — 26 August 2009
2–14.
Chapter 5: LPC24XX External Memory Controller (EMC)
[1]
Table 5–65
Memory type
Static
Static
Static
Static
Dynamic
Dynamic
Dynamic
Dynamic
shows the address ranges
UM10237
© NXP B.V. 2009. All rights reserved.
Size of range
16 MB
16 MB
16 MB
16 MB
256 MB
256 MB
256 MB
256 MB
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