LPC2458FET180,551 NXP Semiconductors, LPC2458FET180,551 Datasheet - Page 542

• Manufacturer Part Number: LPC2458FET180,551
• Description: IC ARM7 MCU FLASH 512K 180TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2458FET180,551

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 136
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 180-TFBGA
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN, Ethernet, I2C, I2S, IrDA, SPI, SSP, UART, USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 136
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA180
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• On-chip Dac: 10 bit, 1 Channel
• Package: 180TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• For Use With: 622-1023 - BOARD SCKT ADAPTER FOR TFBGA180622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-4258; 935282454551; LPC2458FET180-S

NXP Semiconductors
UM10237_4
User manual
5.2.5 SPI format with CPOL = 1,CPHA = 1
5.3 Semiconductor Microwire frame format
The transfer signal sequence for SPI format with CPOL = 1, CPHA = 1 is shown in
Figure
In this configuration, during idle periods:
If the SSP is enabled and there is valid data within the transmit FIFO, the start of
transmission is signified by the SSEL master signal being driven LOW. Master’s MOSI is
enabled. After a further one half SCK period, both master and slave data are enabled onto
their respective transmission lines. At the same time, the SCK is enabled with a falling
edge transition. Data is then captured on the rising edges and propagated on the falling
edges of the SCK signal.
After all bits have been transferred, in the case of a single word transmission, the SSEL
line is returned to its idle HIGH state one SCK period after the last bit has been captured.
For continuous back-to-back transmissions, the SSEL pins remains in its active LOW
state, until the final bit of the last word has been captured, and then returns to its idle state
as described above. In general, for continuous back-to-back transfers the SSEL pin is
held LOW between successive data words and termination is the same as that of the
single word transfer.
Figure 20–101
shows the same format when back-to-back frames are transmitted.
Fig 100. SPI Frame Format with CPOL = 1 and CPHA = 1
•
•
•
The CLK signal is forced HIGH.
SSEL is forced HIGH.
The transmit MOSI/MISO pad is in high impedance.
20–100, which covers both single and continuous transfers.
shows the Microwire frame format for a single frame.
SSEL
MOSI
MISO
SCK
Rev. 04 — 26 August 2009
Q
MSB
MSB
4 to 16 bits
Chapter 20: LPC24XX SSP interface SSP0/1
LSB
LSB
Q
Figure 20–102
UM10237
© NXP B.V. 2009. All rights reserved.
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