LPC2458FET180,551 NXP Semiconductors, LPC2458FET180,551 Datasheet - Page 7

• Manufacturer Part Number: LPC2458FET180,551
• Description: IC ARM7 MCU FLASH 512K 180TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2458FET180,551

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 136
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 180-TFBGA
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN, Ethernet, I2C, I2S, IrDA, SPI, SSP, UART, USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 136
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA180
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• On-chip Dac: 10 bit, 1 Channel
• Package: 180TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• For Use With: 622-1023 - BOARD SCKT ADAPTER FOR TFBGA180622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-4258; 935282454551; LPC2458FET180-S

NXP Semiconductors
Table 6.
Table 7.
Table 8.
Table 9.
UM10237_4
User manual
Type number
LPC2420FBD208
LPC2460FBD208
LPC2460FET208
Type number
LPC2468FBD208 LQFP208
LPC2468FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm SOT950-1
Type number
LPC2468FBD208
LPC2468FET208
Type number
LPC2470FBD208 LQFP208
LPC2470FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 × 15 ×
LPC2420/60 ordering options
LPC2468 ordering information
LPC2468 ordering options
LPC2470 ordering information
5.3 LPC2468 ordering options
5.4 LPC2470 ordering options
Package
Name
Package
Name
Flash
(kB)
512
512
Flash
(kB)
N/A
N/A
N/A
64 16 16 2
64 16 16 2
64 -
64 16 16 2
64 16 16 2
Description
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
Description
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
0.7 mm
SRAM (kB)
SRAM (kB)
16 2
98 Full 32-bit
98 Full 32-bit
82 Full 32-bit
98 Full 32-bit
98 Full 32-bit
Rev. 04 — 26 August 2009
External
bus
External
bus
Ethernet
MII/
RMII
MII/
RMII
Ethernet
-
MII/RMII
MII/RMII
Chapter 1: LPC24XX Introductory information
USB
OTG/
OHC/
DEV
+ 4 kB
FIFO
yes
yes
USB
OTG/
OHCI/
DEV
+ 4 kB
FIFO
yes
yes
yes
2
2
2
2
-
SD/
MMC
yes
yes
SD/
MMC
yes
yes
yes
GP
DMA
yes
yes
yes
GP
DMA
yes
yes
UM10237
© NXP B.V. 2009. All rights reserved.
8
8
8
8
8
1
1
1
1
1
Version
SOT459-1
Version
SOT459-1
SOT950-1
Temp
range
−40 °C to
+85 °C
−40 °C to
+85 °C
−40 °C to
+85 °C
Temp
range
−40 °C to
+85 °C
−40 °C to
+85 °C
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