MC68376BGMAB20 Freescale Semiconductor, MC68376BGMAB20 Datasheet - Page 73

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MC68376BGMAB20

Manufacturer Part Number
MC68376BGMAB20
Description
IC MCU 32BIT 8K ROM 160-QFP
Manufacturer
Freescale Semiconductor
Series
M683xxr
Datasheets

Specifications of MC68376BGMAB20

Core Processor
CPU32
Core Size
32-Bit
Speed
20MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
18
Program Memory Type
ROMless
Ram Size
7.5K x 8
Voltage - Supply (vcc/vdd)
4.75 V ~ 5.25 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
160-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
MC68376BGMAB20
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
4.10.6 BDM Commands
MC68336/376
USER’S MANUAL
— it is imperative that the RSREG command be the first command issued after tran-
sition into BDM.
A double bus fault during initial stack pointer/program counter (SP/PC) fetch sequence
is distinguished by a value of $FFFFFFFF in the current instruction PC. At no other
time will the processor write an odd value into this register.
BDM commands consist of one 16-bit operation word and can include one or more 16-
bit extension words. Each incoming word is read as it is assembled by the serial inter-
face. The microcode routine corresponding to a command is executed as soon as the
command is complete. Result operands are loaded into the output shift register to be
shifted out as the next command is read. This process is repeated for each command
until the CPU returns to normal operating mode. Table 4-6 is a summary of back-
ground mode commands.
NOTES:
Hardware Breakpoint
1. Special status word (SSW) is described in detail in the CPU32 Reference
BGND Instruction
Double Bus Fault
Manual (CPU32RM/AD).
Source
Table 4-5 Polling the BDM Entry Source
CENTRAL PROCESSOR UNIT
ATEMP[31:16]
SSW
$0000
$0000
1
ATEMP[15:0]
$FFFF
$0001
$0000
MOTOROLA
4-21

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