MC68376BGMAB20 Freescale Semiconductor, MC68376BGMAB20 Datasheet - Page 196

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MC68376BGMAB20

Manufacturer Part Number
MC68376BGMAB20
Description
IC MCU 32BIT 8K ROM 160-QFP
Manufacturer
Freescale Semiconductor
Series
M683xxr
Datasheets

Specifications of MC68376BGMAB20

Core Processor
CPU32
Core Size
32-Bit
Speed
20MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
18
Program Memory Type
ROMless
Ram Size
7.5K x 8
Voltage - Supply (vcc/vdd)
4.75 V ~ 5.25 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
160-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68376BGMAB20
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
8.11.1.1 Amplifier Bypass Mode Conversion Timing
8-14
MOTOROLA
QCLK
Figure 8-5 illustrates the timing for conversions. This diagram assumes a final
sampling period of two QCLKs.
If the amplifier bypass mode is enabled for a conversion by setting the amplifier bypass
(BYP) bit in the CCW, the timing changes to that shown in Figure 8-6. The initial sam-
ple time and the transfer time are eliminated, reducing the potential conversion time
by six QCLKs. However, due to internal RC effects, a minimum final sample time of
four QCLKs must be allowed. This results in a savings of four QCLKs. When using the
bypass mode, the external circuit should be of low source impedance, typically less
than 10 k . Also, the loading effects of the external circuitry by the QADC need to be
considered, since the benefits of the sample amplifier are not present.
2 CYCLES
SAMPLE
INITIAL
TIME
SAMPLE AND TRANSFER
QUEUED ANALOG-TO-DIGITAL CONVERTER MODULE
TRANSFER
4 CYCLES
TIME
TIME
Figure 8-5 Conversion Timing
FINAL SAMPLE
N CYCLES:
(2, 4, 8, 16)
TIME
SUCCESSIVE APPROXIMATION RESOLUTION
SEQUENCE
RESOLUTION
10 CYCLES
TIME
USER’S MANUAL
MC68336/376
QADC CONVERSION TIM

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