MC68376BGMAB20 Freescale Semiconductor, MC68376BGMAB20 Datasheet - Page 145

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MC68376BGMAB20

Manufacturer Part Number
MC68376BGMAB20
Description
IC MCU 32BIT 8K ROM 160-QFP
Manufacturer
Freescale Semiconductor
Series
M683xxr
Datasheets

Specifications of MC68376BGMAB20

Core Processor
CPU32
Core Size
32-Bit
Speed
20MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
18
Program Memory Type
ROMless
Ram Size
7.5K x 8
Voltage - Supply (vcc/vdd)
4.75 V ~ 5.25 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
160-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68376BGMAB20
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
6.6 Reset
MC68336/376
USER’S MANUAL
Reset places the SRAM in low-power stop mode, enables program space access, and
clears the base address registers and the register lock bit. These actions make it pos-
sible to write a new base address into the registers.
When a synchronous reset occurs while a byte or word SRAM access is in progress,
the access is completed. If reset occurs during the first word access of a long-word
operation, only the first word access is completed. If reset occurs during the second
word access of a long-word operation, the entire access is completed. Data being read
from or written to the RAM may be corrupted by asynchronous reset. Refer to 5.7 Re-
set for more information about resets.
STANDBY RAM MODULE
MOTOROLA
6-3

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