MC68376BGMAB20 Freescale Semiconductor, MC68376BGMAB20 Datasheet - Page 297

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MC68376BGMAB20

Manufacturer Part Number
MC68376BGMAB20
Description
IC MCU 32BIT 8K ROM 160-QFP
Manufacturer
Freescale Semiconductor
Series
M683xxr
Datasheets

Specifications of MC68376BGMAB20

Core Processor
CPU32
Core Size
32-Bit
Speed
20MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
18
Program Memory Type
ROMless
Ram Size
7.5K x 8
Voltage - Supply (vcc/vdd)
4.75 V ~ 5.25 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
160-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68376BGMAB20
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
MC68336/376
USER’S MANUAL
Num
E10
E11
E12
E13
E14
E15
NOTES:
E1
E2
E3
E4
E5
E6
E7
E8
E9
1. All AC timing is shown with respect to 20% V
2. When the previous bus cycle is not an ECLK cycle, the address may be valid before ECLK goes low.
3. Address access time = t
4. Chip select access time = t
ECLK Low to Address Valid
ECLK Low to Address Hold
ECLK Low to CS Valid (CS delay)
ECLK Low to CS Hold
CS Negated Width
Read Data Setup Time
Read Data Hold Time
ECLK Low to Data High Impedance
CS Negated to Data Hold (Read)
CS Negated to Data High Impedance
ECLK Low to Data Valid (Write)
ECLK Low to Data Hold (Write)
Address Access Time (Read)
Chip Select Access Time (Read)
Address Setup Time
Ecyc
(V
Characteristic
DD
Ecyc
– t
2
= 5.0 Vdc 5%, V
3
ELECTRICAL CHARACTERISTICS
EAD
Table A-8 ECLK Bus Timing
– t
ECSD
4
– t
EDSR
– t
EDSR
.
DD
.
and 70% V
SS
= 0 Vdc, T
DD
levels unless otherwise noted.
A
= T
L
Symbol
to T
t
t
t
t
t
t
t
t
t
t
t
t
EDDW
EDHW
t
t
ECSD
ECSH
ECSN
EDSR
EDHR
EDHZ
ECDH
ECDZ
EACC
EACS
t
EAD
EAH
EAS
H
)
1
Min
308
236
1/2
10
10
25
25
10
5
0
Max
120
48
48
1
2
MOTOROLA
Unit
t
t
t
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
cyc
cyc
cyc
A-21

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