HD64F2623FA20J Renesas Electronics America, HD64F2623FA20J Datasheet - Page 22

• Manufacturer Part Number: HD64F2623FA20J
• Description: IC H8S MCU FLASH 256K 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2623FA20J

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: CAN, SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

17.2 Register Descriptions ........................................................................................................ 616
17.3 Operation .......................................................................................................................... 618
Section 18 RAM
18.1 Overview........................................................................................................................... 621
18.2 Register Descriptions ........................................................................................................ 622
18.3 Operation .......................................................................................................................... 623
18.4 Usage Notes ...................................................................................................................... 623
Section 19 ROM (Preliminary)
19.1 Features ............................................................................................................................. 625
19.2 Overview........................................................................................................................... 626
19.3 Pin Configuration.............................................................................................................. 632
19.4 Register Configuration...................................................................................................... 633
19.5 Register Descriptions ........................................................................................................ 633
19.6 On-Board Programming Modes........................................................................................ 642
19.7 Flash Memory Programming/Erasing ............................................................................... 649
Rev. 5.00 Jan 10, 2006 page xx of xxiv
17.1.2 Block Diagram ..................................................................................................... 614
17.1.3 Pin Configuration................................................................................................. 615
17.1.4 Register Configuration......................................................................................... 615
17.2.1 D/A Data Registers 2 and 3 (DADR2, DADR3) ................................................. 616
17.2.2 D/A Control Register 23 (DACR23).................................................................... 616
17.2.3 Module Stop Control Register C (MSTPCRC).................................................... 618
18.1.1 Block Diagram ..................................................................................................... 621
18.1.2 Register Configuration......................................................................................... 622
18.2.1 System Control Register (SYSCR) ...................................................................... 622
19.2.1 Block Diagram ..................................................................................................... 626
19.2.2 Mode Transitions ................................................................................................. 627
19.2.3 On-Board Programming Modes........................................................................... 628
19.2.4 Flash Memory Emulation in RAM ...................................................................... 630
19.2.5 Differences between Boot Mode and User Program Mode ................................. 631
19.2.6 Block Configuration ............................................................................................ 632
19.5.1 Flash Memory Control Register 1 (FLMCR1)..................................................... 633
19.5.2 Flash Memory Control Register 2 (FLMCR2)..................................................... 637
19.5.3 Erase Block Register 1 (EBR1) ........................................................................... 638
19.5.4 Erase Block Register 2 (EBR2) ........................................................................... 638
19.5.5 RAM Emulation Register (RAMER)................................................................... 639
19.5.6 Flash Memory Power Control Register (FLPWCR) ............................................ 641
19.5.7 Serial Control Register X (SCRX)....................................................................... 641
19.6.1 Boot Mode ........................................................................................................... 643
19.6.2 User Program Mode............................................................................................. 647
.................................................................................................................. 621
........................................................................................ 625