LPC1759FBD80,551 NXP Semiconductors, LPC1759FBD80,551 Datasheet - Page 632

• Manufacturer Part Number: LPC1759FBD80,551
• Description: IC ARM CORTEX MCU 512K 80-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC17xxr

Specifications of LPC1759FBD80,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 80-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 52
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 6x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC17
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: Ethernet, USB, OTG, CAN
• Maximum Clock Frequency: 120 MHz
• Number Of Programmable I/os: 52
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 6 Channel
• On-chip Dac: 10 bit
• Package: 80LQFP
• Device Core: ARM Cortex M3
• Family Name: LPC17xx
• Maximum Speed: 120 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4968; 935290523551

NXP Semiconductors
UM10360
User manual
32.8.1 Prepare sector(s) for write operation
returned in the r0, r1, r2 and r3 registers respectively. Additional parameters are returned
indirectly via memory. Some of the IAP calls require more than 4 parameters. If the ARM
suggested scheme is used for the parameter passing/returning then it might create
problems due to difference in the C compiler implementation from different vendors. The
suggested parameter passing scheme reduces such risk.
The flash memory is not accessible during a write or erase operation. IAP commands,
which results in a flash write/erase operation, use 32 bytes of space in the top portion of
the on-chip RAM for execution. The user program should not be use this space if IAP flash
programming is permitted in the application.
Table 588. IAP Command Summary
This command makes flash write/erase operation a two step process.
IAP Command
Prepare sector(s) for write operation
Copy RAM to Flash
Erase sector(s)
Blank check sector(s)
Read part ID
Read Boot Code version
Read device serial number
Compare
Reinvoke ISP
Fig 138. IAP parameter passing
ARM REGISTER r0
ARM REGISTER r1
All information provided in this document is subject to legal disclaimers.
Chapter 32: LPC17xx Flash memory interface and programming
Rev. 2 — 19 August 2010
Command Code
50
51
52
53
54
55
58
56
57
10
10
10
10
10
10
10
10
10
COMMAND CODE
PARAMETER 1
PARAMETER 2
PARAMETER n
STATUS CODE
RESULT 1
RESULT 2
RESULT n
Described in
Table 589
Table 590
Table 591
Table 592
Table 593
Table 594
Table 595
Table 596
Table 597
UM10360
command
parameter table
command
result table
© NXP B.V. 2010. All rights reserved.
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