LPC1759FBD80,551 NXP Semiconductors, LPC1759FBD80,551 Datasheet - Page 217

IC ARM CORTEX MCU 512K 80-LQFP

LPC1759FBD80,551

Manufacturer Part Number
LPC1759FBD80,551
Description
IC ARM CORTEX MCU 512K 80-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr

Specifications of LPC1759FBD80,551

Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
80-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
120MHz
Connectivity
CAN, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
52
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 6x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
Ethernet, USB, OTG, CAN
Maximum Clock Frequency
120 MHz
Number Of Programmable I/os
52
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 6 Channel
On-chip Dac
10 bit
Package
80LQFP
Device Core
ARM Cortex M3
Family Name
LPC17xx
Maximum Speed
120 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4968
935290523551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1759FBD80,551
Manufacturer:
LT
Quantity:
375
Part Number:
LPC1759FBD80,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC1759FBD80,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
11.7 Operational overview
UM10360
User manual
11.6.5 DMA engine and bus master interface
11.6.6 Register interface
11.6.7 SoftConnect
11.6.8 GoodLink
When enabled for an endpoint, the DMA Engine transfers data between RAM on the AHB
bus and the endpoint’s buffer in EP_RAM. A single DMA channel is shared between all
endpoints. When transferring data, the DMA Engine functions as a master on the AHB
bus through the bus master interface.
The Register Interface allows the CPU to control the operation of the USB Device
Controller. It also provides a way to write transmit data to the controller and read receive
data from the controller.
The connection to the USB is accomplished by bringing D+ (for a full-speed device) HIGH
through a 1.5 kOhm pull-up resistor. The SoftConnect feature can be used to allow
software to finish its initialization sequence before deciding to establish connection to the
USB. Re-initialization of the USB bus connection can also be performed without having to
unplug the cable.
To use the SoftConnect feature, the CONNECT signal should control an external switch
that connects the 1.5 kOhm resistor between D+ and +3.3V. Software can then control the
CONNECT signal by writing to the CON bit using the SIE Set Device Status command.
Good USB connection indication is provided through GoodLink technology. When the
device is successfully enumerated and configured, the LED indicator will be permanently
ON. During suspend, the LED will be OFF.
This feature provides a user-friendly indicator on the status of the USB device. It is a
useful field diagnostics tool to isolate faulty equipment.
To use the GoodLink feature the UP_LED signal should control an LED. The UP_LED
signal is controlled using the SIE Configure Device command.
Transactions on the USB bus transfer data between device endpoints and the host. The
direction of a transaction is defined with respect to the host. OUT transactions transfer
data from the host to the device. IN transactions transfer data from the device to the host.
All transactions are initiated by the host controller.
For an OUT transaction, the USB ATX receives the bi-directional D+ and D- signals of the
USB bus. The Serial Interface Engine (SIE) receives the serial data from the ATX and
converts it into a parallel data stream. The parallel data is written to the corresponding
endpoint buffer in the EP_RAM.
For IN transactions, the SIE reads the parallel data from the endpoint buffer in EP_RAM,
converts it into serial data, and transmits it onto the USB bus using the USB ATX.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 19 August 2010
Chapter 11: LPC17xx USB device controller
UM10360
© NXP B.V. 2010. All rights reserved.
217 of 840

Related parts for LPC1759FBD80,551