S912XET256J2VAGR Freescale Semiconductor, S912XET256J2VAGR Datasheet - Page 1208

• Manufacturer Part Number: S912XET256J2VAGR
• Description: 16-bit Microcontrollers - MCU Watchdog OSC/Timer -40 C to + 105 C HCS12X MCU SPI
• Manufacturer: Freescale Semiconductor

Specifications of S912XET256J2VAGR

• Core: HCS12X
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 256 KB
• Data Ram Size: 16 KB
• On-chip Adc: Yes
• Package / Case: LQFP
• Mounting Style: SMD/SMT
• A/d Bit Size: 12 bit
• A/d Channels Available: 24
• Interface Type: CAN, SCI, SPI
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 119
• Number Of Timers: 25
• Program Memory Type: Flash
• Supply Voltage - Max: 1.98 V, 2.9 V, 5.5 V
• Supply Voltage - Min: 1.72 V, 2.7 V, 3.13 V

Appendix A Electrical Characteristics
1. The values for thermal resistance are achieved by package simulations for the 9S12XEP100 die.
2. Measured per JEDEC JESD51-8. Measured on top surface of the board near the package.
3. Junction to ambient thermal resistance, θ
4. Junction to ambient thermal resistance, θ
5. Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with
6. Thermal characterization parameter Ψ
1208
Num
10
11
12
13
14
15
16
17
18
19
20
horizontal configuration in natural convection.
horizontal configuration in natural convection.
the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described by MIL-
STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package is
being used with a heat sink.
case as defined in JESD51-2. Ψ
enviroment.
1
2
3
4
5
6
7
8
9
C
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
Thermal resistance 208MAPBGA, single sided PCB
Thermal resistance208MAPBGA, double sided PCB
with 2 internal planes
Junction to Board 208MAPBGA
Junction to Case 208MAPBGA
Junction to Package Top 208MAPBGA
Thermal resistance LQFP144, single sided PCB
Thermal resistance LQFP144, double sided PCB
with 2 internal planes
Junction to Board LQFP 144
Junction to Case LQFP 144
Junction to Package Top LQFP144
Thermal resistance LQFP112, single sided PCB
Thermal resistance LQFP112, double sided PCB
with 2 internal planes
Junction to Board LQFP112
Junction to Case LQFP112
Junction to Package Top LQFP112
Thermal resistance QFP 80, single sided PCB
Thermal resistance QFP 80, double sided PCB
with 2 internal planes
Junction to Board QFP 80
Junction to Case QFP 80
Junction to Package Top QFP 80
Table A-5. Thermal Package Characteristics (9S12XEP100)
3
3
(4)
3
JT
Rating
is a useful value to use to estimate junction temperature in a steady state customer
MC9S12XE-Family Reference Manual Rev. 1.25
(5)
4
JT
4
is the “resistance” from junction to reference point thermocouple on top center of the
JA
JA
4
(2)
(6)
was simulated to be equivalent to the JEDEC specification JESD51-2 in a
was simulated to be equivalent to the JEDEC specification JESD51-7 in a
5
5
5
208MAPBGA
LQFP144
LQFP112
3
QFP80
3
(3)
2
Symbol
Ψ
Ψ
Ψ
Ψ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
JC
JC
JC
JC
JA
JA
JB
JA
JA
JB
JA
JA
JB
JA
JA
JB
JT
JT
JT
JT
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
(1)
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Freescale Semiconductor
Max
7.4
53
31
20
41
32
22
43
32
22
45
33
19
11
9
2
3
7
3
3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit