SAM9M10 Atmel Corporation, SAM9M10 Datasheet - Page 270
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SAM9M10
Manufacturer Part Number
SAM9M10
Description
Manufacturer
Atmel Corporation
Datasheets
1.M40800.pdf
(284 pages)
2.SAM9261.pdf
(248 pages)
3.SAM9M10.pdf
(59 pages)
4.SAM9M10.pdf
(1398 pages)
Specifications of SAM9M10
Flash (kbytes)
0 Kbytes
Pin Count
324
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
160
Ext Interrupts
160
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
2
Uart
5
Lin
4
Ssc
2
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
Yes
Camera Interface
Yes
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
64
Self Program Memory
NO
External Bus Interface
2
Dram Memory
DDR2/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No / Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
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• TCR: Temperature Compensated Self Refresh
Reset value is “0”.
This field is unique to Low-power SDRAM. It is used to program the refresh interval during self refresh mode, depending
on the case temperature of the low-power SDRAM.
The values of this field are dependent on Low-power SDRAM devices.
After the initialization sequence, as soon as TCR field is modified, Extended Mode Register is accessed automatically and
TCR bits are updated. In function of UPD_MR bit, update is done before entering in self refresh mode or during a refresh
command and a pending read or write access.
• DS: Drive Strength
Reset value is “0”.
This field is unique to Low-power SDRAM. It selects the driver strength of SDRAM output.
After the initialization sequence, as soon as DS field is modified, Extended Mode Register is accessed automatically and
DS bits are updated. In function of UPD_MR bit, update is done before entering in self refresh mode or during a refresh
command and a pending read or write access.
• TIMEOUT: Low Power Mode
Reset value is “00”.
This field defines when low-power mode is enabled.
• APDE: Active Power Down Exit Time
Reset value is “1”.
This mode is unique to DDR2-SDRAM devices. This mode allows to determine the active power-down mode, which
determines performance versus power saving.
0 = Fast Exit
1 = Slow Exit
After the initialization sequence, as soon as APDE field is modified Extended Mode Register, located in the memory of the
external device, is accessed automatically and APDE bits are updated. In function of the UPD_MR bit, update is done
before entering in self refresh mode or during a refresh command and a pending read or write access
• UPD_MR: Update Load Mode Register and Extended Mode Register
Reset value is “0”.
270
270
00
01
10
11
SAM9M10
SAM9M10
The SDRAM controller activates the SDRAM low-power mode immediately after the end of the last transfer.
The SDRAM controller activates the SDRAM low-power mode 64 clock cycles after the end of the last transfer.
The SDRAM controller activates the SDRAM low-power mode 128 clock cycles after the end of the last transfer.
Reserved
6355D–ATARM–7-Sep-11
6355D–ATARM–7-Sep-11
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