SAM9M10 Atmel Corporation, SAM9M10 Datasheet - Page 264

no-image

SAM9M10

Manufacturer Part Number
SAM9M10
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9M10

Flash (kbytes)
0 Kbytes
Pin Count
324
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
160
Ext Interrupts
160
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
2
Uart
5
Lin
4
Ssc
2
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
Yes
Camera Interface
Yes
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
64
Self Program Memory
NO
External Bus Interface
2
Dram Memory
DDR2/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No / Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
Note: This field is found only in DDR2-SDRAM devices.
• EBISHARE: External Bus Interface is Shared
The DDR controller embedded in the EBI is used at the same time as another memory controller (SMC,..)
Reset value is 0.
0 = Only the DDR controller function is used.
1 = The DDR controller shares the EBI with another memory controller (SMC, NAND,..)
• ACTBST: ACTIVE Bank X to Burst Stop Read Access Bank Y
Reset value is 0.
0 = After an ACTIVE command in Bank X, BURST STOP command can be issued to another bank to stop current read
access.
1 = After an ACTIVE command in Bank X, BURST STOP command cannot be issued to another bank to stop current read
access.
This field is unique to SDR-SDRAM, Low-power SDR-SDRAM and Low-power DDR1-SDRAM devices.
264
264
OCD
000
111
SAM9M10
SAM9M10
OCD calibration mode exit, maintain setting
OCD calibration default
6355D–ATARM–7-Sep-11
6355D–ATARM–7-Sep-11

Related parts for SAM9M10