SAM9M10 Atmel Corporation, SAM9M10 Datasheet - Page 247

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SAM9M10

Manufacturer Part Number
SAM9M10
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9M10

Flash (kbytes)
0 Kbytes
Pin Count
324
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
160
Ext Interrupts
160
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
2
Uart
5
Lin
4
Ssc
2
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
Yes
Camera Interface
Yes
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
64
Self Program Memory
NO
External Bus Interface
2
Dram Memory
DDR2/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No / Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
6355D–ATARM–7-Sep-11
6355D–ATARM–7-Sep-11
Self refresh mode is used to reduce power consumption, i.e., when no access to the SDRAM
device is possible. In this case, power consumption is very low. In self refresh mode, the
SDRAM device retains data without external clocking and provides its own internal clocking,
thus performing its own auto-refresh cycles. All the inputs to the SDRAM device become “don’t
care” except CKE, which remains low. As soon as the SDRAM device is selected, the DDRS-
DRC provides a sequence of commands and exits self refresh mode.
The DDRSDRC re-enables self refresh mode as soon as the SDRAM device is not selected. It is
possible to define when self refresh mode will be enabled by setting the register LPR (see
tion 22.8.7 “DDRSDRC Low-power Register” on page
As soon as the SDRAM device is no longer selected, PRECHARGE ALL BANKS command is
generated followed by a SELF-REFREFSH command. If, between these two commands an
SDRAM access is detected, SELF-REFREFSH command will be replaced by an AUTO-
REFRESH command. According to the application, more AUTO-REFRESH commands will be
performed when the self refresh mode is enabled during the application.
This controller also interfaces low-power SDRAM. These devices add a new feature: A single
quarter, one half quarter or all banks of the SDRAM array can be enabled in self refresh mode.
Disabled banks will be not refreshed in self refresh mode. This feature permits to reduce the self
refresh current. The extended mode register controls this feature, it includes Temperature Com-
pensated Self Refresh (TSCR), Partial Array Self Refresh (PASR) parameters and Drive
Strength (DS). These parameters are set during the initialization phase. After initialization, as
soon as PASR/DS/TCSR fields are modified, the Extended Mode Register in the memory of the
external device is accessed automatically and PASR/DS/TCSR bits are updated before entry
into self refresh mode if DDRSDRC does not share an external bus with another controller or
during a refresh command, and a pending read or write access, if DDRSDRC does share an
external bus with another controller. This type of update is a function of the UPD_MR bit (see
Section 22.8.7 “DDRSDRC Low-power Register” on page
The low-power SDR-SDRAM must remain in self refresh mode for a minimum period of TRAS
periods and may remain in self refresh mode for an indefinite period. (See
The low-power DDR1-SDRAM must remain in self refresh mode for a minimum of TRFC periods
and may remain in self refresh mode for an indefinite period.
The DDR2-SDRAM must remain in self refresh mode for a minimum of TCKE periods and may
remain in self refresh mode for an indefinite period.
• 00 = Self refresh mode is enabled as soon as the SDRAM device is not selected
• 01 = Self refresh mode is enabled 64 clock cycles after completion of the last access
• 10 = Self refresh mode is enabled 128 clock cycles after completion of the last access
269), timeout command bit:
269).
Figure
SAM9M10
SAM9M10
22-17)
Sec-
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