SAM9M10 Atmel Corporation, SAM9M10 Datasheet - Page 1341

• Manufacturer Part Number: SAM9M10
• Manufacturer: Atmel Corporation

Specifications of SAM9M10

• Flash (kbytes): 0 Kbytes
• Pin Count: 324
• Max. Operating Frequency: 400 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 160
• Ext Interrupts: 160
• Usb Transceiver: 3
• Usb Speed: Hi-Speed
• Usb Interface: Host, Device
• Spi: 2
• Twi (i2c): 2
• Uart: 5
• Lin: 4
• Ssc: 2
• Ethernet: 1
• Sd / Emmc: 2
• Graphic Lcd: Yes
• Video Decoder: Yes
• Camera Interface: Yes
• Adc Channels: 8
• Adc Resolution (bits): 10
• Adc Speed (ksps): 440
• Resistive Touch Screen: Yes
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 64
• Self Program Memory: NO
• External Bus Interface: 2
• Dram Memory: DDR2/LPDDR, SDRAM/LPSDR
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 0.9 to 1.1
• Fpu: No
• Mpu / Mmu: No / Yes
• Timers: 6
• Output Compare Channels: 6
• Input Capture Channels: 6
• Pwm Channels: 4
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

47.4
47.4.1
Table 47-5.
47.4.2
Table 47-6.
47.5
Table 47-7.
Note:
6355D–ATARM–7-Sep-11
Symbol
1/(t
Symbol
1/(t
Symbol
1/(t
C
C
C
t
I
P
I
ST
DDST
DD ON
ON
CRYSTAL
INT
LEXT
CPPCK
CPMCK
CPMAIN
(1)
Clock Characteristics
Main Oscillator Characteristics
1. The C
(1)
)
)
)
Processor Clock Characteristics
Master Clock Characteristics
asitic capacitance, package and board, must be calculated in order to reach 15 pF (minimum targeted load for the
oscillator) by taking into account the internal load C
tance must be: 15 pF - 4 pF = 11 pF which means that 22 pF is the target value (22 pF from xin to gndosc and 22 pF from
xout to gndosc) If 20 pF load is targeted, the sum of pad, package, board and external capacitances must be 20 pF - 4 pF =
16 pF which means 32 pF (32 pF from xin to gndosc and 32 pF from xout to gndosc).
Parameter
Crystal Oscillator Frequency
Crystal Load Capacitance
Internal Load Capacitance
External Load Capacitance
Duty Cycle
Startup Time
Standby Current Consumption
Drive Level
Current Dissipation
Processor Clock Waveform Parameters
Master Clock Waveform Parameters
Main Oscillator Characteristics
CRYSTAL
Parameter
Processor Clock Frequency
Parameter
Master Clock Frequency
value is specified by the crystal manufacturer. In our case, C
The master clock is the maximum clock at which the system is able to run. It is given by the
smallest value of the internal bus clock and EBI clock.
Note:
1. For DDR2 usage, there are no limitations to LDDDR, SDRAM and mobile SDRAM.
Conditions
C
C
Standby mode
@ 8 MHz
@ 16 MHz
CRYSTAL
CRYSTAL
Conditions
VDDCORE = 0.9V
T = 85°C
Conditions
VDDCORE = 0.9V
T = 85°C
= 15 pF
= 20 pF
INT
(1)
(1)
. So, to target the minimum oscillator load of 15 pF, external capaci-
CRYSTAL
0.35
Min
125
125
0.7
15
40
Min
Min
8
(1)
(1)
must be between 15 pF and 20 pF. All par-
Typ
12
22
32
50
4
Max
Max
400
133
SAM9M10
Max
0.55
150
1.1
16
20
60
2
1
Units
Units
MHz
MHz
MHz
Unit
μW
mA
mA
ms
pF
pF
pF
pF
μA
%
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