LPC1810FET100,551 NXP Semiconductors, LPC1810FET100,551 Datasheet - Page 22
LPC1810FET100,551
Manufacturer Part Number
LPC1810FET100,551
Description
IC MCU 32BIT 136KB FLSH 100TFBGA
Manufacturer
NXP Semiconductors
Series
LPC18xxr
Datasheets
1.LPC1830FET256551.pdf
(87 pages)
2.LPC1810FET100551.pdf
(2 pages)
3.LPC1810FET100551.pdf
(1164 pages)
Specifications of LPC1810FET100,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
64
Program Memory Size
-
Program Memory Type
ROMless
Eeprom Size
-
Ram Size
136K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TFBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- Current page: 22 of 1164
- Download datasheet (8Mb)
3.1 How to read this chapter
3.2 Features
3.3 Functional description
<Document ID>
User manual
This chapter applies to flashless parts LPC1850/30/20/10 only.
The boot ROM memory includes the following features:
AES capable parts also support:
The internal ROM memory is used to store the boot code. After a reset, the ARM
processor will start its code execution from this memory.
The ARM core is configured to start executing code, upon reset, with the program counter
being set to the value 0x0000 0000. The LPC18xx contains a shadow pointer that allows
areas of memory to be mapped to address 0x0000 0000. The default value of the shadow
pointer is 0x1040 0000, ensuring that the code contained in the boot ROM is executed at
reset.
Several boot modes are available depending on the values of the OTP bits BOOT_SRC. If
the OTP memory is not programmed or the BOOT_SRC bits are all zero, the boot mode is
determined by the states of the boot pins p2_8, P2_8, P1_2, and P1_1.
•
•
•
•
•
•
•
•
•
UM10430
Chapter 3: LPC18xx Boot ROM
Rev. 00.13 — 20 July 2011
ROM memory size is 64 kB.
Supports booting from UART interfaces and external static memory such as NOR
flash, SPI flash, quad SPI flash.
Includes APIs for power control and OTP programming.
Includes SPIFI and USB drivers.
ISP mode for loading data to on-chip SRAM and execute code from on-chip SRAM.
CMAC authentication on the boot image.
Secure booting from an encrypted image.
Supports development mode for booting from a plain text image. Development mode
is terminated by programming the AES key.
API for AES programming.
All information provided in this document is subject to legal disclaimers.
Rev. 00.13 — 20 July 2011
© NXP B.V. 2011. All rights reserved.
User manual
22 of 1164
Related parts for LPC1810FET100,551
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
Lpc1850/30/20/10 32-bit Arm Cortex-m3 Mcu; Up To 200 Kb Sram; Ethernet, Two High-speed Usb, Lcd, And External Memory Controller
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors