HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 95

• Manufacturer Part Number: HD6473258P10
• Description: IC H8 MCU OTP 32K 64DIP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/325r

Specifications of HD6473258P10

• Core Processor: H8/300
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: SCI, UART/USART
• Number Of I /o: 53
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: OTP
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 64-DIP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Peripherals: -

Input Latches: All pins of port 3 have input latches which can be enabled by the LTE bit in the
handshake control/status register (HCSR) in mode 3. When the LTE bit is set to 1, input data are
latched on the falling edge of the input strobe (IS) signal and held in the input strobe latch until
read. When the LTE bit is cleared to 0, input data are passed through the input strobe latch without
being held.
See section 6, Parallel Handshaking Interface for further information.
Reset and Hardware Standby Mode: P3DDR and P3DR are cleared to all 0, and all parallel
handshaking functions are disabled. All pins are placed in the input (high-impedance) state with the
MOS pull-ups off.
Software Standby Mode: P3DDR and P3DR remain in their previous state. In modes 1 and 2, all
pins are placed in the input (high-impedance) state. In mode 3, all pins remain in their previous
input or output state.
Figure 5-3 shows a schematic diagram of port 3.
86