HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 300

IC H8 MCU OTP 32K 64DIP

HD6473258P10

Manufacturer Part Number
HD6473258P10
Description
IC H8 MCU OTP 32K 64DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/325r
Datasheet

Specifications of HD6473258P10

Core Processor
H8/300
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI, UART/USART
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Peripherals
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6473258P10
Manufacturer:
EXEL
Quantity:
6 218
Part Number:
HD6473258P10
Manufacturer:
HIT
Quantity:
1 000
Part Number:
HD6473258P10
Manufacturer:
RENESAS
Quantity:
1 000
Part Number:
HD6473258P10V
Manufacturer:
RENESAS
Quantity:
600
Part Number:
HD6473258P10V
Manufacturer:
RENESAS
Quantity:
1 200
Part Number:
HD6473258P10V
Manufacturer:
HITACHI/日立
Quantity:
20 000
Figure E-1 shows the dimensions of the DC-64S package. Figure E-2 shows the dimensions of the
DP-64S package. Figure E-3 shows the dimensions of the FP-64A package. Figure E-4 shows the
dimensions of the CP-68 package.
64
1
1.78 ± 0.25
64
1
1.778 ± 0.250
1.0
58.50 Max
Appendix E. Package Dimensions
0.9
57.6
57.30
Figure E-1. Package Dimensions (DC-64S)
Figure E-2. Package Dimensions (DP-64S)
0.48 ± 0.10
0.48 ± 0.10
33
32
33
32
304
0° – 15°
0.25
0.25
19.05
19.05
+ 0.11
– 0.05
+ 0.11
– 0.05
Unit: mm
Unit: mm

Related parts for HD6473258P10