HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 16

IC H8 MCU OTP 32K 64DIP

HD6473258P10

Manufacturer Part Number
HD6473258P10
Description
IC H8 MCU OTP 32K 64DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/325r
Datasheet

Specifications of HD6473258P10

Core Processor
H8/300
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI, UART/USART
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Peripherals
-

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1.3 Pin Assignments and Functions
1.3.1 Pin Arrangement
Figure 1-2 shows the pin arrangement of the H8/325 Series in the DC-64S and DP-64S packages.
Figure 1-3 shows the pin arrangement in the FP-64A package. Figure 1-4 shows the pin
arrangement in the CP-68 package.
Figure 1-2. Pin Arrangement (DC-64S, DP-64S, Top View)
P4 /TMCI
P4 /TMRI
P4 /TMCI
P4 /TMRI
P4 /TMO
P4 /TMO
P6 /FTOA
P6 /FTOB
P5 /SCK
P5 /SCK
P5 /RxD
P5 /RxD
P5 /TxD
P5 /TxD
P6 /IRQ
P6 /IRQ
P6 /IRQ
P6 /FTCI
P7 /OS
0
2
3
5
P6 /FTI
1
4
1
2
2
5
P7 /IS
1
4
EXTAL
0
3
4
5
P4 /E
0
6
P4 /ø
STBY
XTAL
1
3
RES
0
MD
MD
NMI
V
V
6
7
CC
SS
0
0
0
1
1
1
0
0
0
1
1
1
1
0
0
1
2
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
1
2
3
4
5
6
7
8
9
6
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
P3 /D
P3 /D
P3 /D
P3 /D
P3 /D
P3 /D
P3 /D
P3 /D
P1 /A
P1 /A
P1 /A
P1 /A
P1 /A
P1 /A
P1 /A
P1 /A
V
P2 /A
P2 /A
P2 /A
P2 /A
P2 /A
P2 /A
P2 /A
P2 /A
V
P7 /WAIT
P7 /RD
P7 /WR
P7 /AS
P7 /IOS
P7 /BUSY
SS
CC
7
6
5
4
3
2
1
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
7
6
5
4
3
2
8
9
10
11
12
13
14
15
7
6
5
4
3
2
1
0
0
1
2
3
4
5
6
7

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