HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 214

IC H8 MCU OTP 32K 64DIP

HD6473258P10

Manufacturer Part Number
HD6473258P10
Description
IC H8 MCU OTP 32K 64DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/325r
Datasheet

Specifications of HD6473258P10

Core Processor
H8/300
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI, UART/USART
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Peripherals
-

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(2) Case of H8/325, H8/323, and H8/322
The write, verify, inhibited, and read sub-modes of the PROM mode are selected as shown in table
11-5.
Table 11-5. Selection of Sub-Modes in PROM Mode
Mode
Write
Verify
Programming inhibited
Note: The V
The H8/325 PROM uses the same, standard read/write specifications as the HN27C256 and
HN27256.
11.3.2 Writing and Verifying
An efficient, high-speed programming procedure can be used to write and verify PROM data. This
procedure writes data quickly without subjecting the chip to voltage stress and without sacrificing
data reliability. It leaves the data H’FF written in unused addresses.
PP
and V
CC
pins must be held at the V
CE
Low
High
High
OE
High
Low
High
V
V
V
V
PP
PP
PP
PP
Pins
209
PP
V
V
V
V
CC
CC
CC
CC
and V
CC
E0
Data input
Data output
High-impedance
7
voltage levels.
to E0
0
EA
Address input
Address input
Address input
14
to EA
0

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