HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 235

IC H8 MCU OTP 32K 64DIP

HD6473258P10

Manufacturer Part Number
HD6473258P10
Description
IC H8 MCU OTP 32K 64DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/325r
Datasheet

Specifications of HD6473258P10

Core Processor
H8/300
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI, UART/USART
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Peripherals
-

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Table 14-1. External Crystal Parameters
Frequency (MHz)
Rs max (Ω)
C
kept away from the crystal circuit to prevent induction from interfering with correct oscillation.
See figure 14-4. The crystal and its load capacitors should be placed as close as possible to the
XTAL and EXTAL pins.
0
Crystal Oscillator: The external crystal should have the characteristics listed in table 16-1.
Note on Board Design: When an external crystal is connected, other signal lines should be
(pF)
XTAL
Figure 14-2. Connection of Crystal Oscillator (Example)
Figure 14-3. Equivalent Circuit of External Crystal
2
500
EXTAL
XTAL
4
120
L
8
60
7 pF max
C
L
232
C
C
12
40
C
L1
L2
0
AT-cut parallel resonating crystal
C
L1
16
30
= C
L2
R
= 15 to 22 pF
S
Fig 14-2
20
20
EXTAL

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