HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 129

• Manufacturer Part Number: HD6473258P10
• Description: IC H8 MCU OTP 32K 64DIP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/325r

Specifications of HD6473258P10

• Core Processor: H8/300
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: SCI, UART/USART
• Number Of I /o: 53
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: OTP
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 64-DIP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Peripherals: -

When the ISIE and LTE bits in the handshake control/status register (HCSR) are both set to 1, if a
high-to-low transition of the IS signal occurs during software standby mode, an input strobe
interrupt is requested and the chip recovers from software standby mode to handle the interrupt.
If the parallel handshaking interface is set for input, the port 3 input data are also latched.
If either the ISIE or LTE bit is cleared to 0, then high-to-low transitions of the IS signal are ignored
during software standby mode.
6.3.4 Sample Application
Figure 6-6 shows an example in which the parallel handshaking interface is used to interconnect
two H8/325 chips. Figure 6-7 shows the interface timing.
Port 3
Ø
OS
H8/325 (sending chip)
Figure 6-5. Output Strobe Timing in Software Standby Mode
Figure 6-6. Sample Usage of Parallel Handshaking Interface
Port 3 write
P3 to P3
7
OS
IS
0
T
1
Software
standby mode
Same data held
Same state held
120
Clock
settling time
H8/325 (receiving chip)
T
P3 to P3
IS
OS
2
T + T = 7 system clocks
1
7
2
0
Fig 6-5