HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 27

IC H8 MCU OTP 32K 64DIP

HD6473258P10

Manufacturer Part Number
HD6473258P10
Description
IC H8 MCU OTP 32K 64DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/325r
Datasheet

Specifications of HD6473258P10

Core Processor
H8/300
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI, UART/USART
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Peripherals
-

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External memory is accessed a byte at a time in three or more states. The basic bus cycle is three
states, but additional wait states can be inserted on request.
2.3.2 IOS
There are two gaps in the on-chip address space above the on-chip RAM. Addresses H’FF80 to
H’FF8F, situated between the on-chip RAM and register field, are off-chip. Addresses H’FFA0 to
H’FFAF are also off-chip. These 32 addresses can be conveniently assigned to external I/O devices.
To simplify the addressing of devices at these addresses, an IOS signal is provided that goes low
when the CPU accesses addresses H’FF00 to H’FFFF. The IOS signal can be used in place of the
upper 8 bits of the address bus.
17

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