HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 124

IC H8 MCU OTP 32K 64DIP

HD6473258P10

Manufacturer Part Number
HD6473258P10
Description
IC H8 MCU OTP 32K 64DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/325r
Datasheet

Specifications of HD6473258P10

Core Processor
H8/300
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI, UART/USART
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Peripherals
-

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6.1.3 Input and Output Pins
Table 6-1 lists the input and output pins used by the parallel handshaking interface.
Table 6-1. Input and Output Pins of Parallel Handshaking Interface
Name
Data input/output pins
Input strobe
Output strobe
Busy
6.1.4 Register Configuration
Table 6-2 lists information about the parallel handshaking interface registers.
Table 6-2. Register Configuration
Name
Port 3 data direction register
Port 3 data register
Handshake control/status register HCSR
6.2 Register Descriptions
6.2.1 Port 3 Data Direction Register (P3DDR)
Bit
Initial value
Read/Write
To use the parallel handshaking interface for input, clear P3DDR to H'00. For output, set P3DDR to
H'FF. Do not set the bits individually.
See Section 5.4, Port 3 for further information.
P3
7
W
DDR P3
7
0
6
Abbreviation
P3
IS
OS
BUSY
W
DDR P3
6
0
7
– P3
Abbreviation
P3DDR
P3DR
0
5
W
DDR P3
5
0
I/O
I/O
I
O
O
115
4
W
DDR P3
4
0
R/W
W
R/W
R/W
Function
Data input and output
Strobe for input data
Strobe for output data
Busy signal
3
W
DDR P3
3
0
Initial value
H'00
H'00
H'03
2
W
DDR P3
2
0
1
Address
H'FFB4
H'FFB6
H'FFFE
W
DDR P3
1
0
0
W
DDR
0
0

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